Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer
View Patent ↗The objects of the present invention is to improve the impact resistance of the semiconductor device against the impact from the top surface direction, to improve the corrosion resistance of the surface of the top layer interconnect, to inhibit the crack occurred in the upper layer of the interconnect layer when the surface of the electrode pad is poked with the probe during the non-defective/defective screening, and to prevent the corrosion of the interconnect layer when the surface of electrode pad is poked with the probe during the non-defective/defective screening. A Ti film 116 , a TiN film 115 and a pad metal film 117 are formed in this sequence on the upper surface of a Cu interconnect 112. The thermal annealing process is conducted within an inert gas atmosphere to form a Ti—Cu layer 113, and thereafter a polyimide film 118 is formed, and then a cover through hole is provided thereon to expose the surface of the pad metal film 117, and finally a solder ball 120 is joined thereto.
1. A semiconductor device, comprising:
an interconnect layer provided on a semiconductor substrate;
a protective film provided on said interconnect layer;
an electrode pad provided on said protective film; and
an anti-oxidizing layer containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, said anti-oxidizing layer being disposed between said interconnect layer and said protective film, wherein said electrode pad is in electrical contact with said interconnect layer and is disposed on said protective film in a position to permit contact by a probe, and wherein said different element of said anti-oxidizing layer is a metal having a lower oxidation-reduction potential than that of said element contained in said interconnect layer, said element being a metal, and said anti-oxidizing layer being disposed between said interconnect layer and said protective film in a position that inhibits corrosion of said interconnect layer when an interface between said electrode pad and said interconnect layer is damaged by said probe, and wherein said different element is a group IV element or a group VI element in long form periodic table.
2. The semiconductor device according to claim 1 , wherein said interconnect layer is a copper-containing metal.
3. The semiconductor device according to claim 1 , wherein said different element is Ti or Si.
4. A semiconductor device, comprising:
an interconnect layer provided on a semiconductor substrate;
a protective film provided on said interconnect layer;
an electrode pad provided on said protective film; and
an anti-oxidizing layer containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, said anti-oxidizing layer being disposed between said interconnect layer and said protective film, wherein said electrode pad is in electrical contact with said interconnect layer and is disposed on said protective film in a position to permit contact by a probe, and wherein said different element of said anti-oxidizing layer has a lower oxidation-reduction potential than that of said element contained in said interconnect layer, and said anti-oxidizing layer being disposed between said interconnect layer and said protective film in a position that inhibits corrosion of said interconnect layer when an interface between said electrode pad and said interconnect layer is damaged by said probe, wherein said protective film includes a Ti layer or a TiN layer.
5. A semiconductor device, comprising:
an interconnect layer provided on a semiconductor substrate;
a protective film provided on said interconnect layer;
an electrode pad provided on said protective film; and
an anti-oxidizing layer containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, said anti-oxidizing layer being disposed between said interconnect layer and said protective film, wherein said electrode pad is in electrical contact with said interconnect layer and is disposed on said protective film in a position to permit contact by a probe, and wherein said different element of said anti-oxidizing layer has a lower oxidation-reduction potential than that of said element contained in said interconnect layer, and said anti-oxidizing layer being disposed between said interconnect layer and said protective film in a position that inhibits corrosion of said interconnect layer when an interface between said electrode pad and said interconnect layer is damaged by said probe, wherein said anti-oxidizing layer is a layer where the upper part of said interconnect layer is modified, and comprises said different element and said same element contained in said interconnect layer.
6. A semiconductor device, comprising:
an interconnect layer provided on a semiconductor substrate;
a protective film provided on said interconnect layer;
an electrode pad provided on said protective film; and
an anti-oxidizing layer containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, said anti-oxidizing layer being disposed between said interconnect layer and said protective film, wherein said electrode pad is in electrical contact with said interconnect layer and is disposed on said protective film in a position to permit contact by a probe, and said anti-oxidizing layer being disposed between said interconnect layer and said protective film in a position that inhibits corrosion of said interconnect layer when an interface between said electrode pad and said interconnect layer is damaged by said probe, and wherein said protective film includes a Ti layer or a TiN layer.
7. A semiconductor device, comprising:
an interconnect layer provided on a semiconductor substrate;
a protective film provided on said interconnect layer;
an electrode pad provided on said protective film; and
an anti-oxidizing layer containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, said anti-oxidizing layer being disposed between said interconnect layer and said protective film, wherein said electrode pad is in electrical contact with said interconnect layer and is disposed on said protective film in a position to permit contact by a probe, and said anti-oxidizing layer being disposed between said interconnect layer and said protective film in a position that inhibits corrosion of said interconnect layer when an interface between said electrode pad and said interconnect layer is damaged by said probe, and wherein said anti-oxidizing layer is a layer where the upper part of said interconnect layer is modified, and comprises said different element and said same element contained in said interconnect layer.
8. A semiconductor device, comprising:
an interconnect layer provided over a semiconductor substrate;
an electrically conductive anti-oxidizing layer formed over, and in contact with, a part of said interconnect layer and containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, and wherein said different element of said anti-oxidizing layer is a metal having a lower oxidation-reduction potential than that of said element contained in said interconnect layer; and
a bonding pad metal film provided over said electrically conductive anti-oxidizing layer to form an electrical conduction with said interconnect layer, wherein said interconnect layer is a copper-containing metal, and said electrically conductive anti-oxidizing layer contains one of Ti—Cu layer and Si—Cu layer.
9. The semiconductor device according to claim 8 , further comprising:
an electrically conductive protective film intervening between said electrically conductive anti-oxidizing layer and said bonding pad metal film.
10. The semiconductor device according to claim 9 , wherein said electrically conductive protective film contains Ti layer and TiN layer.
11. The semiconductor device according to claim 10 , further comprising:
a solder ball adheres to said bonding pad metal film.
12. A semiconductor device, comprising;
an interconnect layer provided over a semiconductor substrate;
an electrically conductive anti-oxidizing layer formed over, and in contact with, a part of said interconnect layer and containing a same element as an element in said interconnect layer that is chemically bonded or alloyed with a different element which is different from said element contained in said interconnect layer, and wherein said different element of said anti-oxidizing layer is a metal having a lower oxidation-reduction potential than that of said element contained in said interconnect layer; and
a bonding pad metal film provided over said electrically conductive anti-oxidizing layer to form an electrical conduction with said interconnect layer, wherein said interconnect layer is a copper-containing metal, and said electrically conductive anti-oxidizing layer contains one of Ti—Cu layer and Si—Cu layer.
13. The semiconductor device according to claim 12 , further comprising:
an electrically conductive protective film intervening between said electrically conductive anti-oxidizing layer and said bonding pad metal film.
14. The semiconductor device according to claim 13 , wherein said
electrically conductive protective film contains Ti layer and TiN layer.