Glass molding die
View Patent ↗A molding die for molding glass thousand times is provided in the invention. The molding die includes a substrate, a first intermediate layer of Ni-containing Ir—Re alloy overlying the substrate, a second intermediate layer of metal-containing Ir—Re alloy overlying the first intermediate layer, and a passivation film overlying the second intermediate layer. The Ni concentration of the first intermediate layer decreases gradually with distance from the substrate/first intermediate layer interface. The metal is Cr, Ta, Ti, or Ti—Cr alloy. The metal concentration of the second intermediate layer increases with distance from the first intermediate layer/second intermediate layer interface.
1. A molding die for molding glass, comprising:
a substrate;
a first intermediate layer of Ni-containing Ir—Re alloy overlying the substrate, with Ni concentration decreasing with distance from the substrate/first intermediate layer interface;
a second intermediate layer of metal-containing Ir—Re alloy overlying the first intermediate layer, the metal selected from a group consisting of Cr, Ta, Ti, and Ti—Cr alloy, in concentration increasing with distance from the first intermediate layer/second intermediate layer interface; and
a passivation film overlying the second intermediate layer.
2. The molding die as claimed in claim 1 , wherein the substrate comprises tungsten carbide.
3. The molding die as claimed in claim 1 , wherein maximum Ni concentration of the first intermediate layer is between 20 and 30 at %.
4. The molding die as claimed in claim 1 , wherein minimum Ni concentration of the first intermediate layer is between 5 and 10 at %.
5. The molding die as claimed in claim 1 , wherein atomic ratio of Ir to Re of the first intermediate layer is between 99 to 1 and 70 to 30.
6. The molding die as claimed in claim 1 , wherein atomic ratio of Ir to Re of the first intermediate layer is between 99 to 1 and 90 to 10.
7. The molding die as claimed in claim 1 , wherein the thickness of first intermediate layer is about 0.1 to 0.3 μm.
8. The molding die as claimed in claim 1 , wherein maximum Cr concentration of the second intermediate layer is between 40 and 50 at %.
9. The molding die as claimed in claim 1 , wherein Cr concentration of the second intermediate layer is at least higher than 0 at %.
10. The molding die as claimed in claim 1 . wherein maximum Ta concentration of the second intermediate layer is between 20 and 25 at %.
11. The molding die as claimed in claim 1 , wherein Ta concentration of the second intermediate layer is at least higher than 0 at %.
12. The molding die as claimed in claim 1 , wherein maximum Ti concentration of the second intermediate layer is between 20 and 25 at %.
13. The molding die as claimed in claim 1 , wherein Ti concentration of the second intermediate layer is at least higher than 0 at %.
14. The molding die as claimed in claim 1 , wherein maximum Ti—Cr alloy concentration of the second intermediate layer is between 30 and 38 at %.
15. The molding die as claimed in claim 1 , wherein Ti—Cr alloy concentration of the second intermediate layer is at least higher than 0 at %.
16. The molding die as claimed in claim 1 , wherein atomic ratio of Ir to Re of the second intermediate layer is between 99 to 1 and 70 to 30.
17. The molding die as claimed in claim 1 , wherein atomic ratio of Ir to Re of the second intermediate layer is between 99 to 1 and 90 to 10.
18. The molding die as claimed in claim 1 , wherein the thickness of second intermediate layer is about 0.1 to 0.3 μm.
19. The molding die as claimed in claim 1 , wherein the passivation film comprises nitride-containing Ir—Re alloy.
20. The molding die as claimed in claim 19 , wherein atomic ratio of Ir to Re of the passivation film is between 99 to 1 and 70 to 30.
21. The molding die as claimed in claim 19 , wherein atomic ratio of Ir to Re of the passivation film is between 99 to 1 and 90 to 10.
22. The molding die as claimed in claim 19 , wherein the nitride is chromium nitride, tantalum nitride, titanium nitride, or titanium chromium nitride.
23. The molding die as claimed in claim 22 , wherein the nitride is chromium nitride when the metal is Cr.
24. The molding die as claimed in claim 22 , wherein the nitride is tantalum nitride when the metal is Ta.
25. The molding die as claimed in claim 22 , wherein the nitride is titanium nitride when the metal is Ti.
26. The molding die as claimed in claim 22 . wherein the nitride is titanium chromium nitride when the metal is Ti—Cr alloy.
27. The molding die as claimed in claim 1 , wherein the thickness of passivation film is about 0.5 to 2 μm.
28. The molding die as claimed in claim 1 , wherein the passivation film comprises a molding surface.
29. A molding die for molding glass, comprising:
a substrate;
a first intermediate layer of Ni-containing Ir—Re alloy overlying the substrate, with Ni concentration decreasing with distance from the substrate/first intermediate layer interface;
an intermediate buffer layer of Ir—Re alloy overlying the substrate;
a second intermediate layer of metal-containing Ir—Re alloy overlying the intermediate buffer layer, the metal selected from a group consisting of Cr, Ta, Ti, and Ti—Cr alloy, in concentration increasing with distance from the intermediate buffer layer/second intermediate layer interface; and
a passivation film overlying the second intermediate layer.
30. The molding die as claimed in claim 29 , wherein the substrate is tungsten carbide.
31. The molding die as claimed in claim 29 , wherein maximum Ni concentration of the first intermediate layer is between 20 and 30 at %.
32. The molding die as claimed in claim 29 , wherein minimum Ni concentration of the first intermediate layer is between 5 and 10 at %.
33. The molding die as claimed in claim 29 , wherein atomic ratio of Ir to Re of the first intermediate layer is between 99 to 1 and 70 to 30.
34. The molding die as claimed in claim 29 , wherein atomic ratio of Ir to Re of the first intermediate layer is between 99 to 1 and 90 to 10.
35. The molding die as claimed in claim 29 , wherein the thickness of first intermediate layer is about 0.1 to 0.3 μm.
36. The molding die as claimed in claim 29 , wherein maximum Cr concentration of the second intermediate layer is between 40 and 50 at %.
37. The molding die as claimed in claim 29 , wherein Cr concentration of the second intermediate layer is at least higher than 0 at %.
38. The molding die as claimed in claim 29 , wherein maximum Ta concentration of the second intermediate layer is between 20 and 25 at %.
39. The molding die as claimed in claim 29 , wherein Ta concentration of the second intermediate layer is at least higher than 0 at %.
40. The molding die as claimed in claim 29 , wherein maximum Ti concentration of the second intermediate layer is between 20 and 25 at %.
41. The molding die as claimed in claim 29 , wherein Ti concentration of the second intermediate layer is at least higher than 0 at %.
42. The molding die as claimed in claim 29 , wherein maximum Ti—Cr alloy concentration of the second intermediate layer is between 30 and 38 at %.
43. The molding die as claimed in claim 29 , wherein Ti—Cr alloy concentration of the second intermediate layer is at least higher than 0 at %.
44. The molding die as claimed in claim 29 , wherein atomic ratio of Ir to Re of the second intermediate layer is between 99 to 1 and 70 to 30.
45. The molding die as claimed in claim 29 , wherein atomic ratio of Ir to Re of the second intermediate layer is between 99 to 1 and 90 to 10.
46. The molding die as claimed in claim 29 , wherein the thickness second intermediate layer is about 0.1 to 0.3 μm.
47. The molding die as claimed in claim 29 , wherein atomic ratio of Ir to Re of the intermediate buffer layer is between 99 to 1 and 70 to 30.
48. The molding die as claimed in claim 29 , wherein atomic ratio of Ir to Re of the intermediate buffer layer is between 99 to 1 and 90 to 10.
49. The molding die as claimed in claim 29 , wherein the thickness of intermediate buffer layer is about 0.01 to 0.1 μm.
50. The molding die as claimed in claim 29 , wherein the passivation film is nitride-containing Ir—Re alloy.
51. The molding die as claimed in claim 50 , wherein atomic ratio of Ir to Re of the passivation film is between 99 to 1 and 70 to 30.
52. The molding die as claimed in claim 50 , wherein atomic ratio of Ir to Re of the passivation film is between 99 to 1 and 90 to 10.
53. The molding die as claimed in claim 50 , wherein the nitride is chromium nitride, tantalum nitride, titanium nitride, or titanium chromium nitride.
54. The molding die as claimed in claim 53 , wherein the nitride is chromium nitride when the metal is Cr.
55. The molding die as claimed in claim 53 , wherein the nitride is tantalum nitride when the metal is Ta.
56. The molding die as claimed in claim 53 , wherein the nitride is titanium nitride when the metal is Ti.
57. The molding die as claimed in claim 53 , wherein the nitride is titanium chromium nitride when the metal is Ti—Cr alloy.
58. The molding die as claimed in claim 29 , wherein the thickness of passivation film is about 0.5 to 2 μm.
59. The molding die as claimed in claim 29 , wherein the passivation film comprises a molding surface.