IP Library › Granted Patent US 7,109,592
Granted Patent B2
US 7,109,592 · App. 10/806,806 · Granted Sep 19, 2006

SMT passive device noflow underfill methodology and structure

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Quick Facts
Patent No.
US 7,109,592
App. No.
10/806,806
Granted
Sep 19, 2006
Kind
B2
Abstract

An electronic fabrication process and structure is provided for attaching discrete passive surface mount devices (SMD) to a substrate in a single step. A liquid noflow resin encapsulant containing flux material is dispensed between presoldered pads on a substrate. The SMD, having a pair of electrical contacts, is pressed into said encapsulant so that the electrical contacts make contact with said presoldered pads. Heat is applied to first activate said flux material and then reflow the solder on said presoldered pads to bond said SMD contacts to said presoldered pads. The reflow temperature is maintained for about 180 seconds during which time the resin solidifies. The resin encapsulant fills the space between substrate and SMD and forms fillets around the solder bonded contacts.

Claims (3)

1. An electronic package, comprising:

a substrate having at least two electrical contact pads thereon; and

a passive SMD having at least two electrical contacts each having at least a lower electrical contact surface and an upper electrical contact surface at the terminus thereof with at least said lower electrical contact surface of said at least two electrical contacts of said passive SMD respectively positioned toward said at least two electrical contact pads of said substrate and with said at least said lower electrical contact surface and said upper electrical contact surface at the terminus thereof of said at least two electrical contacts each respectively bonded by a solder connection to the said at least two electrical contact pads on said substrate such that said upper contact surface is covered by said solder connection, said passive SMD encapsulated by a resin formed from an epoxy-based flux encapsulant with flux combined into a one part epoxy system such that the space between said passive SMD and said substrate is filled with said resin and with said resin further forming fillets around each said passive SMD solder connection including forming fillets covering said solder connection covering said upper contact surface.