Microcap wafer bonding apparatus
View Patent ↗A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.
1. A hermetically sealed integrated circuit package, comprising:
an integrated circuit comprising a substrate having an upper surface, a perimeter being disposed upon the upper surface and defining a hermetically sealed portion therewithin, at least one circuit element being disposed within the hermetically sealed portion;
a hermetic cap comprising a top member and a gasket, the cap being configured to cover the hermetically sealed portion and form a hermetically sealed cavity thereover, the gasket comprising opposing first inner and first outer vertical sidewalls depending downwardly from the cap, the sidewalls terminating in and being separated by a bottom edge;
a bonding agent disposed between and engaging the substrate and the bottom edge to form a hermetic seal between the cap and the substrate and thereby hermetically seal the cavity, the bonding agent further comprising opposing second inner and second outer sidewalls disposed between the substrate and the gasket, the second inner sidewall being located within the hermetically sealed porton, the second outer sidewall being located outside the hermetically sealed portion, and
a caulking agent disposed along and engaging the first inner and outer vertical sidewalls and the second inner sidewall and the second outer sidewall such that the caulking agent extends between and covers substantially all of and is directly in contact with the first inner and outer vertical sidewalls and the second inner sidewall and the second outer sidewall, the caulking agent extending between the substrate and the top member and being configured to seal the cavity and improve the hermeticity of the hermetic seal formed by the bonding agent.
2. The hermetically sealed integrated circuit package of claim 1 , wherein the caulking agent comprises multiple layers of caulking material.
3. The hermetically sealed integrated circuit package of claim 1 , wherein the bonding agent comprises gold.
4. The hermetically sealed integrated circuit package of claim 1 , wherein the caulking agent comprises at least one of an amorphous fluorocarbon polymer, a polyimide material, and a benzocyclobutene-based material.
5. The hermetically sealed integrated circuit package of claim 1 , wherein a thickness of the gasket between the first inner sidewall and the first outer sidewall ranges between about 1 micron and about 10 microns.
6. The hermetically sealed integrated circuit package of claim 1 , wherein the at least one circuit element comprises at least one of a resonator, a transistor and a connector.
7. The hermetically sealed integrated circuit package of claim 1 , wherein the substrate comprises silicon.