IP Library Granted Patent US 7,067,233
Granted Patent B2
US 7,067,233 · App. 10/807,861 · Granted Jun 27, 2006

Compound having an epoxy group and a chalcone group, method of preparing the same, and photoresist composition comprising the same

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Quick Facts
Patent No.
US 7,067,233
App. No.
10/807,861
Granted
Jun 27, 2006
Kind
B2
Abstract

A compound including an epoxy group that has a heat curing property and a chalcone group that has a radiation curing property is represented by the following formula: wherein n is an integer from 1 to 10,000, and each of R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 is selected from a group consisting of a hydrogen atom, alkyl group, alkoxy group, halogen atom and nitro group. The compound has a high curing efficiency. A photoresist composition including the compound above substantially prevents the formation of remnant in a photoresist pattern used in the manufacturing of a color filter. In addition, the color filter pattern that is formed using the photoresist composition has high color reproductivity and brightness.

Claims (16)

1. A resist composition comprising:

(a) a compound comprising an epoxy group and a chalcone group represented by the following formula:

wherein n is an integer from 1 to 10,000 and each of R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 and R 8 is selected from a group consisting of a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom and a nitro group;

(b) an acrylate resin;

(c) a curing agent; and

(d) an organic solvent.

2. The resist composition of claim 1 , wherein the resist composition includes about 5 to about 35 parts by weight of the compound, about 0.01 to about 5 parts by weight of the curing agent, and about 60 to about 90 by weight of the organic solvent.

3. The resist composition of claim 1 , wherein the organic solvent is propylene glycol monomethyl ether acetate, ethyl ethoxy acetate, or cyclohexanone.

4. The resist composition of claim 1 , wherein the resist composition includes about 5 to about 35 parts by weight of a combination of the acrylate resin and the compound, about 0.01 to about 5 parts by weight of the curing agent, and about 60 to about 90 by weight of the organic solvent.

5. The resist composition of claim 1 , further comprising a pigment, wherein the pigment is dissolved in a solvent.

6. The resist composition of claim 5 , further comprising a dispersant for dispersing the pigment in the photoresist composition.

7. The resist composition of claim 1 , further comprising a photo-initiator.

8. The resist composition of claim 7 , wherein the photo-initiator is benzl dimethyl ketal, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, or bis(trichloromethyl)-s-triazine derivative.

9. The resist composition according to claim 1 , wherein the compound has a weight average molecular weight of about 800 to about 20,000.

10. The resist composition according to claim 5 , wherein the pigment is a red, blue, green, yellow, or violel pigment.

11. The resist composition according to claim 1 , wherein the curing agent is a dipentaerithritol hexaacrylate or a trimethylolpropane trimethacrylate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029045/0860 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2004
From: KANG, YOO-HO; BAE, DONG-HO; KIM, JANG-SUB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 015145/0971 →