A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.
1. A power module comprising:
a first substrate with a power semiconductor device mounted thereon;
a second substrate with a control circuit for controlling said power semiconductor device formed thereon;
a smoothing capacitor electrically connected to said power semiconductor device for smoothing a voltage to be externally supplied to said power semiconductor device; and
a case including a case frame and a case lid, said case having an interior in which said first substrate, said second substrate and said smoothing capacitor are disposed, and said smoothing capacitor is disposed in contact with a side surface of said case frame.
2. The power module according to claim 1 , wherein said smoothing capacitor is a ceramic capacitor.
3. The power module according to claim 1 , wherein said smoothing capacitor is buried in said case frame.
4. A power module comprising:
a first substrate with a power semiconductor device mounted thereon;
a second substrate with a control circuit for controlling said power semiconductor device formed thereon;
a smoothing capacitor electrically connected to said power semiconductor device for smoothing a voltage to be externally supplied to said power semiconductor device;
a case including a case frame and a case lid, said case having an interior in which said first substrate, said second substrate and said smoothing capacitor are disposed; and
a heat sink for dissipating heat generated from said first substrate, said first substrate and said case frame being placed on said heat sink,
wherein said smoothing capacitor is disposed on said heat sink.