Nanowhiskers with pn junctions, doped nanowhiskers, and methods for preparing them
View Patent ↗Nano-engineered structures are disclosed, incorporating nanowhiskers of high mobility conductivity and incorporating pn junctions. In one embodiment, a nanowhisker of a first semiconducting material has a first band gap, and an enclosure comprising at least one second material with a second band gap encloses said nanoelement along at least part of its length, the second material being doped to provide opposite conductivity type charge carriers in respective first and second regions along the length of the of the nanowhisker, whereby to create in the nanowhisker by transfer of charge carriers into the nanowhisker, corresponding first and second regions of opposite conductivity type charge carriers with a region depleted of free carriers therebetween. The doping of the enclosure material may be degenerate so as to create within the nanowhisker adjacent segments having very heavy modulation doping of opposite conductivity type analogous to the heavily doped regions of an Esaki diode. In another embodiment, a nanowhisker is surrounded by polymer material containing dopant material. A step of rapid thermal annealing causes the dopant material to diffuse into the nanowhisker. In a further embodiment, a nanowhisker has a heterojunction between two different intrinsic materials, and Fermi level pinning creates a pn junction at the interface without doping.
1. A structure, comprising:
a crystalline semiconductor nanowhisker of a first conductivity type; and
an enclosure comprising a bulk semiconductor region of a second conductivity type opposite to the first conductivity type enclosing and in contact with said nanowhisker along at least part of its length;
wherein a combination of the nanowhisker and the bulk semiconductor region forms a pn junction.
2. The structure of claim 1 , wherein the nanowhisker is intrinsically first conductivity type.
3. The structure of claim 1 , wherein:
the nanowhisker comprises a one-dimensional nanoelement of a first crystalline III-V semiconductor material having a first bandgap;
the enclosure comprises at least one second semiconductor bulk material having a second bandgap different from the first band gap; and
the bandgaps of the nanoelement and the enclosure are such that it is energetically favorable for charge carriers to remain in said nanoelement.
4. The structure of claim 1 , wherein said enclosure comprises a semiconductor material deposited on the sides of said nanoelement.
5. A method of forming a pn junction in a structure comprising a one-dimensional nanoelement, the method comprising:
forming a crystalline semiconductor one dimensional nanoelement comprising a nanowhisker doped with a first conductivity type dopant upstanding from a substrate; and
forming an enclosure comprising a bulk semiconductor region of a second conductivity type opposite to the first conductivity type enclosing and in contact with said nanowhisker along at least part of its length;
wherein a combination of the nanowhisker and the bulk semiconductor region forms a pn junction.
6. The method of claim 5 , wherein:
the nanowhisker comprises a first crystalline III-V semiconductor material having a first bandgap;
the enclosure comprises at least one second semiconductor bulk material having a second bandgap different from the first band gap; and
the bandgaps of the nanoelement and the enclosure are such that it is energetically favorable for charge carriers to remain in said nanoelement.
7. The method of claim 5 , wherein the step of forming said enclosure comprises growing a semiconductor material on sides of said nanoelement using bulk material growth conditions.
8. The structure of claim 1 , wherein the nanowhisker is doped with a first conductivity type dopant.
9. The method of claim 5 , wherein the nanowhisker is intrinsically first conductivity type.