Method for manufacturing a magnetic head coil structure and/or pole tip structure
View Patent ↗A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.
1. A process for manufacturing at least one of a pole structure and a coil structure for a magnetic head, comprising:
depositing a conductive layer;
depositing a photoresist layer on the conductive layer;
depositing a silicon dielectric layer on the photoresist layer;
masking the silicon dielectric layer;
etching at least one channel in the photoresist layer and the silicon dielectric layer; and
filling the at least one channel with a conductive material to define at least one of a coil structure, and a pole tip structure;
wherein an aspect ratio of the at least one channel is at least about 7;
wherein a grain size of the conductive material is less than half of a smallest dimension of the at least one channel.
2. The process as recited in claim 1 , wherein the conductive layer includes Cu if the coil structure is being formed.
3. The process as recited in claim 1 , wherein the conductive material includes Cu.
4. The process as recited in claim 1 , wherein the silicon dielectric layer includes SiO2.
5. The process as recited in claim 1 , wherein the etching includes reactive ion etching (RIE).
6. The process as recited in claim 1 , wherein the masking includes depositing another photoresist layer.
7. The process as recited in claim 1 , and further comprising removing the silicon dielectric layer.
8. The process as recited in claim 1 , and further comprising depositing an adhesion promoter layer between the silicon dielectric layer and the photoresist layer.
9. The process as recited in claim 1 , wherein the conductive layer includes a magnetic material.
10. The process as recited in claim 1 , wherein the conductive material includes a magnetic material.
11. The process as recited in claim 9 , wherein the magnetic material is selected from the group consisting of NiFe, CoFe, and CoNiFe.
12. The process as recited in claim 1 , wherein the coil structure includes a P2 pole tip structure.
13. The process as recited in claim 1 , wherein the conductive layer includes an Si-containing material.
14. A process for manufacturing at least one of a pole structure and coil structure for a magnetic head, comprising:
depositing a conductive layer;
depositing a photoresist layer on the conductive layer;
depositing a silicon dielectric layer on the photoresist layer;
masking the silicon dielectric layer;
etching at least one channel in the photoresist layer and the silicon dielectric layer; and
filling the at least one channel with a conductive material to define at least one of a coil structure and a pole tip structure,
wherein an aspect ratio of the at least one channel is at least 7.
15. The process as recited in claim 14 , wherein a grain size of the conductive material is less than half of a smallest dimension of the at least one channel.
16. The process as recited in claim 15 , wherein the grain size facilitates the depositing of the conductive material in the at least one channel.
17. A process for manufacturing at least one of a pole tip and a coil structure for a magnetic head, comprising:
depositing a conductive layer;
depositing a photoresist layer on the conductive layer;
depositing a silicon dielectric layer on the photoresist layer;
masking the silicon dielectric layer;
etching at least one channel in the photoresist layer and the silicon dielectric layer; and
filling the at least one channel with a conductive material to define at least one of the pole tip and the coil structure,
wherein a grain size of the conductive material is less than half of a smallest dimension of the at least one channel.
18. The process as recited in claim 17 , wherein the coil structure includes a P2 pole tip structure.