Antenna-incorporated semiconductor device
View Patent ↗Disclosed is an inexpensive semiconductor device which has a built-in antenna capable of efficiently radiating low-power microwaves and has excellent productivity. An IC chip is mounted on a lead frame on which a chip base for mounting an IC chip, an inverted-F antenna and a ground electrode are integrated and is molded with an encapsulating resin. At this time, a gap portion, which is formed between the open end of the resonance portion of the inverted-F antenna and the distal end portion of the ground electrode, is not molded with the encapsulating resin and is left open as a window. This can permit electric waves to be efficiently irradiated from the open end of the antenna exposed to air through the window. As this semiconductor device has nearly the same structure as that of an ordinary semiconductor device, it is excellent in productivity and can be fabricated at a low cost.
1. An antenna-incorporated semiconductor device comprising:
a semiconductor integrated circuit chip having a high-frequency power circuit;
a lead frame having a ground electrode and an antenna element having one end connected to said ground electrode and an other end open;
a wire which connects an input/output electrode of said high-frequency power circuit of said semiconductor integrated circuit chip to a power supply portion of said antenna element; and
an encapsulating resin encapsulating said semiconductor integrated circuit chip, said lead frame and said wire,
wherein said open end of said antenna element and said ground electrode facing said open end are exposed through an opening portion provided in a part of said encapsulating resin of said antenna-incorporated semiconductor device.
2. The antenna-incorporated semiconductor device according to claim 1 , wherein said antenna element is an inverted-F antenna.
3. The antenna-incorporated semiconductor device according to claim 1 , wherein said input/output electrode of said high-frequency power circuit of said semiconductor integrated circuit chip is connected to said power supply portion of said antenna element via a coupling capacitor.
4. An antenna-incorporated semiconductor device comprising:
a semiconductor integrated circuit chip having a high-frequency power circuit;
a lead frame having a ground electrode and an antenna element having one end connected to said ground electrode and an other end open;
a wire which connects an input/output electrode of said high-frequency power circuit of said semiconductor integrated circuit chip to a power supply portion of said antenna element;
an encapsulating resin encapsulating said semiconductor integrated circuit chip, said lead frame and said wire; and
a coaxial cable connecting connector which is provided in an opening portion provided in a part of said encapsulating resin of said antenna-incorporated semiconductor device and has connection electrodes being said open end of said antenna element and an end portion of said ground electrode.
5. The antenna-incorporated semiconductor device according to claim 4 , wherein said connector is a female type and has a back side covered with a dielectric.
6. The antenna-incorporated semiconductor device according to claim 4 , wherein said connector is a female type and a dielectric guide for positional alignment of a male connector on a coaxial cable side with a back side of said capacitor and burying a gap therebetween.