High density nanostructured interconnection
View Patent ↗A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.
1. An interconnection for use with electrical components comprising:
a first surface;
a second surface;
a plurality of nanostructures disposed on at least one of said first surface and said second surface, said plurality of nanostructures configured to attach said first surface and said second surface using attractive forces and in a way such that said nanostructures form at least a first conductive connection between said first surface and said second surface.
2. The interconnection of claim 1 wherein said conductive connection comprises a thermal connection.
3. The interconnection of claim 1 wherein said conducting connection comprises an electrical connection.
4. The interconnection of claim 1 wherein said plurality of nanostructures comprises:
a first plurality of nanostructures disposed on at least a first area of said first surface; and
a second plurality of nanostructures disposed in at least a first area of said second surface,
wherein said first plurality of nanostructures and said second plurality of nanostructures are adapted to transfer thermal or electrical energy from said first plurality of nanostructures to said second plurality of nanostructures.
5. The interconnection of claim 1 wherein said attractive forces comprise attractive intermolecular forces.
6. The interconnection of claim 5 wherein said intermolecular forces comprise Van Der Waals forces.
7. The interconnection of claim 5 wherein said intermolecular forces comporise dipole-dipole forces.
8. A method for transferring thermal or electrical energy across an interconnection, said method comprising:
contacting a first plurality of conductive nanostructures with a second plurality of conductive nanostructures, said first plurality and said second plurality attaching to one another using attractive forces,
wherein at least a portion of said nanostructures in said first plurality and a portion of said nanostructures in said second plurality comprise a conductive material.
9. The method of claim 8 wherein said conductive material is a thermally conductive material.
10. The method of claim 8 wherein said conductive material is an electrically conductive material.
11. The method as recited in claim 8 wherein the attractive forces are intermolecular or capillary attractive forces.
12. A method for transferring thermal or electrical energy across an interconnection, said method comprising:
bringing a plurality of nanostructures on a first surface into contact with a second surface; and
causing at least a portion of the nanostructures in said plurality of nanostructures to adhere to said second surface using attractive forces.
13. The method of claim 12 wherein said step of causing comprises contacting said plurality of nanostructures with said second surface in a way such that the molecules of said at least a portion of the nanostructures are attracted to the molecules of said at least a second surface.
14. The method as recited in claim 12 wherein the attractive forces are intermolecular or capillary attractive forces.