IP Library Granted Patent US 7,417,292
Granted Patent B2
US 7,417,292 · App. 10/817,583 · Granted Aug 26, 2008

Arrangement for connecting the terminal contacts of an optoelectronic component to a printed circuit board

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Quick Facts
Patent No.
US 7,417,292
App. No.
10/817,583
Granted
Aug 26, 2008
Kind
B2
Abstract

An arrangement for connecting the terminal contacts of an optoelectronic component to electrical contacts of a printed circuit board using a flexible conductor arrangement. The flexible conductor arrangement has a planar form and includes a plurality of interconnects that are arranged to provide an electrical connection between the terminal contacts of the optoelectronic component and the electrical contacts of the printed circuit board. The flexible conductor arrangement is bent in such a way that, starting from the printed circuit board, it is led around the optoelectronic component and contacts the latter on a side facing away from the printed circuit board.

Claims (41)

1. An arrangement comprising:

an optoelectronic component comprising terminal contacts and an optical window through which light can enter or leave the optoelectronic component,

a printed circuit board with electrical contacts, and

a flexible conductor including a plurality of interconnects, where the flexible conductor is connected to the optoelectronic component and the printed circuit board such that the interconnects electrically connect the terminal contacts of the optoelectronic component and corresponding electrical contacts of the printed circuit board, an opening being defined in the flexible conductor and arranged for optical communication with the optoelectronic component by way of the window, and the flexible conductor including a bend configured and arranged such that a portion optoelectronic component resides in a region defined by the bend.

2. The arrangement as claimed in claim 1 , the flexible conductor having a first portion with contact regions connected to the electrical contacts of the printed circuit board and a second portion with contact regions connected to the terminal contacts of the optoelectronic component, and the flexible conductor being bent at least in a third portion lying between the first portion and the second portion.

3. The arrangement as claimed in claim 2 , wherein the optoelectronic component includes a leadframe for contacting purposes, and wherein the respective contact regions of the second portion of the flexible conductor are each electrically connected to a corresponding leg of the leadframe.

4. The arrangement as claimed in claim 2 , wherein the first portion of the flexible conductor runs substantially parallel to the surface of the printed circuit board.

5. The arrangement as claimed in claim 2 , the first portion of the conductor arrangement, connected to the printed circuit board, being arranged on the end face of the printed circuit board and running perpendicularly in relation to the surface of the printed circuit board.

6. The arrangement as claimed in claim 1 , wherein the plurality of interconnects of the flexible conductor are arranged in a flexible dielectric.

7. The arrangement as recited in claim 1 , wherein the optoelectronic component includes a laser arranged for optical communication with the optical window and with the opening defined in the flexible conductor.

8. The arrangement as recited in claim 7 , further comprising a monitor diode arranged for optical communication with the laser.

9. The arrangement as recited in claim 1 , further comprising a leadframe that is electrically connected to the flexible conductor and to the optoelectronic component.

10. The arrangement as recited in claim 1 , wherein the flexible conductor comprises a multi-layered form.

11. The arrangement as recited in claim 1 , wherein the printed circuit board comprises a transceiver board of an electro-optical converter.

12. The arrangement as recited in claim 1 , wherein the optoelectronic component includes a receiving element.

13. The arrangement as recited in claim 1 , wherein the optoelectronic component is arranged on the flexible conductor.

14. The arrangement as recited in claim 13 , wherein the flexible conductor includes a plurality of contact pads which are physically connected to a leadframe of the optoelectronic component.

15. An arrangement comprising:

an optoelectronic component comprising terminal contacts and an optical window through which light can enter or leave the optoelectronic component,

a printed circuit board with electrical contacts, and

a flexible conductor of a planar form and including a plurality of interconnects, where the flexible conductor is connected to the optoelectronic component and the printed circuit board such that the interconnects electrically connect the terminal contacts of the optoelectronic component and corresponding electrical contacts of the printed circuit board,

wherein the flexible conductor is bent in such a way that, starting from the printed circuit board, the flexible conductor is led around the optoelectronic component and contacts the optoelectronic component on a side facing away from the printed circuit board and upon which the optical window is arranged,

wherein an opening is defined in the flexible conductor through which light can enter or leave the optoelectronic component, the opening defined opposite the optical window,

wherein the flexible conductor has a first portion with contact regions connected to the electrical contacts of the printed circuit board and a second portion with contact regions connected to the terminal contacts of the optoelectronic component, and the flexible conductor being bent at least in a third portion lying between the first portion and the second portion, wherein the third portion has at least one region of maximum curvature.

16. The arrangement as claimed in claim 15 , the flexible conductor having in the region of maximum curvature a bending radius which is equal to or greater than a minimum bending radius, which fixes a maximum permissible curvature of the flexible conductor.

17. The arrangement as claimed in claim 15 , the optoelectronic component being arranged at least partly between two subregions of the flexible conductor which adjoin the region of maximum curvature of the flexible conductor.

18. The arrangement as claimed in claim 17 , the subregions of the flexible conductor adjoining the region of maximum curvature running at least partially parallel.

19. The arrangement as claimed in claim 18 , the at least partially parallel-running subregions of the flexible conductor being at a distance from each other which is greater than a thickness of the optoelectronic component.

20. An arrangement comprising:

a printed circuit board including an electrical contact;

an optoelectronic component mounted to the printed circuit board such that a first side faces toward the printed circuit board and a second side faces away from the printed circuit board, wherein the optoelectronic component includes a terminal contact formed on the second side, and

a flexible flat cable including a first contact region located adjacent to a first end portion, a second contact region located adjacent to a second end portion, and an elongated conductor extending between the first and second contact regions along a third portion of the flexible flat cable that extends between the first end portion and the second end portion,

wherein the flexible flat cable is connected between the printed circuit board and the optoelectronic component such that the first contact region is connected to the electrical contact of the printed circuit board at a point adjacent to the first side of the optoelectronic component, the second contact region is connected to the terminal contact on the second side of the optoelectronic component, and the third portion of the flexible cable extends around the optoelectronic component,

wherein the first end portion, the third portion, and the second end portion define an approximate U shape in the flexible conductor arrangement, and

wherein at least a portion of the optoelectronic component is located within the approximate U shape of the flexible conductor arrangement.

21. An arrangement comprising:

a printed circuit board;

an optoelectronic component mounted to the printed circuit board such that a first side faces toward the printed circuit board and a second side faces away from the printed circuit board, and

a flexible flat cable including a first end portion connected to the printed circuit board, a second end portion connected to the second side of the optoelectronic component such that substantially the entire length and width of the second side of the optoelectronic component is adjacent to the second end portion, and a third portion extending between the first and second end portions,

wherein the third portion defines a bent region, a first straight region extending between the bent region and the first end portion, a second straight region extending between the bent region and the second end portion, and

wherein the first and second straight regions are substantially parallel.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →