Optical semiconductor component to prevent electric leakage and provide different driving voltages
View Patent ↗An optical semiconductor component has multiple conducting wire holders, multiple chip carriers secured, multiple semiconductor chips, a first curved surface made of the conducting wire holders, the semiconductor chips being placed at its focus, multiple connecting components made of the conducting wire holders, and a second curved surface surrounded by a package body, the semiconductor chips being placed at its focus. The chip carriers are independent components and have a multi-layer structure. The middle layer is an insulator used to separate the chip from the conducting wire holder electrically or thermally. Hence, when connected with a metal radiator, the chip carrier does not cause electric leakage. Further, the connecting components of the present invention are mutually independent, which can provide multiple photodiodes with different driving voltages to connect with each other in series or parallel.
1. An optical semiconductor component, comprising:
a plurality of conducting wire holders;
a plurality of independent chip carriers secured on the conducting wire holders, wherein the independent chip carriers have a multi-layer structure, middle layers of the independent chip carriers being insulators used to separate the semiconductors from the conducting wire holders;
a plurality of semiconductor chips secured on the independent chip carriers;
a first curved surface made of a portion of the conducting wire holders, wherein the semiconductor chips are placed at a focus of the first curved surface;
a plurality of independent connecting components made of another portion of the conducting wire holders; and
a second curved surface surrounded by a package body, wherein the semiconductor chips are placed at a focus of the second curved surface.
2. The optical semiconductor component as claimed in claim 1 , wherein upper surfaces of the independent chip carriers are conductors used to electrically connect with the semiconductor chips.
3. The optical semiconductor component as claimed in claim 1 , wherein lower surfaces of the independent chip carriers are conductors or insulators.
4. The optical semiconductor component as claimed in claim 1 , wherein the first curved surface is coated with a material able to enhance a reflective capability.
5. The optical semiconductor component as claimed in claim 4 , wherein the first curved surface is a paraboloidal or an ellipsoidal surface.
6. The optical semiconductor component as claimed in claim 1 , wherein a portion of the independent connecting components is located inside the package body for electrically connecting with the semiconductor chips and another portion of the independent connecting components is projected from the package body for electrically connecting an external circuit.
7. The optical semiconductor component as claimed in claim 1 , wherein the second curved surface is made of or coated with a material able to enhance a reflective capability.
8. The optical semiconductor component as claimed in claim 7 , wherein the second curved surface is a paraboloidal or an ellipsoidal surface.
9. The optical semiconductor component as claimed in claim 8 , wherein the second curved surface is a smooth surface.
10. The optical semiconductor component as claimed in claim 1 , further comprising a window for light to pass through, wherein the window is formed by the first curved surface and the second curved surface.
11. The optical semiconductor component as claimed in claim 10 , wherein the semiconductor chips and the independent chip carrier are placed inside the window.
12. The optical semiconductor component as claimed in claim 10 , wherein the window is covered by a transparent optical component.
13. The optical semiconductor component as claimed in claim 12 , wherein the transparent optical component is a planar lens, a convex lens or a concave lens.
14. An optical semiconductor component, comprising:
a plurality of conducting wire holders;
a plurality of independent chip carriers secured on the conducting wire holders;
a plurality of semiconductor chips secured on the independent chip carriers;
a first curved surface made of a portion of the conducting wire holders, wherein the semiconductor chips are placed at a focus of the first curved surface;
a plurality of independent connecting components made of another portion of the conducting wire holders; and
a second curved surface surrounded by a package body, wherein the semiconductor chips are placed at a focus of the second curved surface;
wherein the first curved surface is coated with a material able to enhance a reflective capability.
15. The optical semiconductor component as claimed in claim 14 , wherein the first curved surface is a paraboloidal or an ellipsoidal surface.
16. An optical semiconductor component, comprising:
a plurality of conducting wire holders;
a plurality of independent chip carriers secured on the conducting wire holders;
a plurality of semiconductor chips secured on the independent chip carriers;
a first curved surface made of a portion of the conducting wire holders, wherein the semiconductor chips are placed at a focus of the first curved surface;
a plurality of independent connecting components made of another portion of the conducting wire holders; and
a second curved surface surrounded by a package body, wherein the semiconductor chips are placed at a focus of the second curved surface;
wherein the second curved surface is made of or coated with a material able to enhance a reflective capability.
17. The optical semiconductor component as claimed in claim 16 , wherein the second curved surface is a paraboloidal or an ellipsoidal surface.
18. The optical semiconductor component as claimed in claim 17 , wherein the second curved surface is a smooth surface.