Bond separation inspection method using compressive thermal strain in optical sensor part
View Patent ↗A bond separation inspection method using an optical fiber sensor. The method includes a step of embedding a sensor part of an optical fiber sensor in an adhesive joining a plurality of members together. The sensor part is embedded in the adhesive in such a way that the sensor part undergoes a compressive strain. Separation of the bond is detected on the basis of an optical characteristic of the sensor part when light from a light source is directed into the optical fiber sensor.
1. A bond separation inspection method comprising:
joining together two members with an adhesive;
embedding a sensor part of an optical fiber sensor in the adhesive;
introducing light from a light source into one end of the optical fiber sensor and causing light from the sensor part to emerge from another end of the optical fiber sensor; and
detecting separation of the bond of the two members on the basis of an optical characteristic of the light from the sensor part,
wherein embedding the sensor part in the adhesive includes causing a compressive thermal strain to arise in the sensor part due to different thermal expansivities of the adhesive and the sensor part so a refractive index period of the sensor part is sufficiently reduced such that a wavelength of reflected light emerging from the another end of the optical fiber caused by a bond separation is separated from a wavelength of reflected light caused inherently by the sensor part.
2. The bond separation inspection method according to claim 1 , wherein causing the compressive strain in the sensor part comprises using a thermo-setting adhesive as the adhesive and hardening the adhesive at a temperature higher than room temperature and then returning it to room temperature.
3. The bond separation inspection method according to claim 1 , wherein the optical fiber sensor is an optical fiber grating sensor.
4. The bond separation inspection method according to claim 1 , wherein the light source is a broadband light source.
5. The bond separation inspection method according to claim 1 , wherein the optical characteristic is an optical characteristic of reflected light reflected in the sensor part.
6. The bond separation inspection method according to claim 1 , wherein the optical characteristic is an optical characteristic of transmitted light passing through the sensor part.
7. The bond separation inspection method according to claim 5 , wherein the optical characteristic of the reflected light is a spectrum characteristic of the reflected light.
8. The bond separation inspection method according to claim 5 , wherein the optical characteristic of the reflected light is a strength characteristic of the reflected light at a predetermined wavelength.
9. The bond separation inspection method according to claim 6 , wherein the optical characteristic of the transmitted light is a spectrum characteristic of the transmitted light.
10. The bond separation inspection method according to claim 6 , wherein the optical characteristic of transmitted light is a strength characteristic of the transmitted light at a predetermined wavelength.
11. The bond separation inspection method according to claim 1 , further comprising:
applying a predetermined load to the two members.
12. The bond separation inspection method according to claim 11 , wherein the predetermined load is a load applied to the two members in a direction such that it tends to increase any separation of the bond.
13. The bond separation inspection method according to claim 11 , wherein applying the load comprises applying external forces which deform the two members elastically.
14. The bond separation inspection method according to claim 1 , wherein the refractive index period is reduced by at least 50% caused by the thermal compressive strain.