IP Library Granted Patent US 7,800,078
Granted Patent B2
US 7,800,078 · App. 10/824,587 · Granted Sep 21, 2010

Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna

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Quick Facts
Patent No.
US 7,800,078
App. No.
10/824,587
Granted
Sep 21, 2010
Kind
B2
Abstract

A printed circuit device used in conjunction with inductive power and data transmission applications is formed substantially of ferrite material, with an inductive coil conductor formed around the substrate to increase the electromagnetic properties of the coil for both power and data transmission functions, thereby eliminating the need for a discrete ferrite core wire-wound coil to be connected to the circuit device.

Claims (34)

1. A printed circuit device, comprising:

a substrate including a circuit component section and a coil section that is separate from the circuit component section, said substrate being formed substantially of ferrite material, said substrate having top and bottom surfaces, first and second side surfaces between said top and bottom surfaces along a major dimension thereof, and first and second end surfaces between said top and bottom surfaces along a minor dimension thereof;

at least one circuit component mounted to a main surface of said substrate in said circuit component section; and

a conductor formed around said coil section of said substrate and extending over one of said main surfaces and side surfaces in a coil pattern; and

wherein said printed circuit device is a component of an implantable sensor device that is capable of performing quantitative analyte measurements within a body of a living organism.

2. The printed circuit device of claim 1 , wherein said at least one circuit component lead is routed through a via formed in said substrate.

3. The printed circuit device of claim 2 , wherein said at least one circuit component comprises a light-emitting diode (LED) and a lead for said LED.

4. The printed circuit device of claim 3 , wherein said lead for said LED is a drive lead.

5. The printed circuit device of claim 2 , wherein said at least one circuit component lead is routed through a plurality of vias formed in said substrate.

6. The printed circuit device of claim 5 , wherein a plurality of circuit component leads are routed through a plurality of vias formed in said substrate.

7. The printed circuit device of claim 1 , wherein said coil is edge-joined around said substrate.

8. The printed circuit device of claim 1 , wherein said coil is used for transfer of data signals to an external device.

9. The printed circuit device of claim 1 , wherein said coil is used for inductive transfer of electric power from an external power supply.

10. The printed circuit device of claim 1 , wherein said at least one circuit component comprises a light-emitting diode (LED) and wherein said printed circuit device further including at least one photodetector.

11. The printed circuit device of claim 1 , further comprising a via formed in said substrate for routing of a conductor for a circuit component.

12. The printed circuit device of claim 1 , wherein the conductor is printed on the substrate.

13. In an electronic device having an integrated circuit formed on a printed circuit device and an inductive coil for data and/or power transfer, the improvement comprising:

forming a substrate of said printed circuit device substantially of ferrite material such that said substrate includes a coil section and a separate circuit component section; and

forming the inductive coil around said coil section of said substrate of the printed circuit device and using said printed circuit device as a ferrite core for said inductive coil; and

wherein said printed circuit device is a component of an implantable sensor device that is capable of performing quantitative analyte measurements within a body of a living organism.

14. A fluorescence sensor device, comprising:

a light source for introducing light into a fluorescent indicator that interacts with a medium;

a photodetector for detecting light emitted by said fluorescent indicator in response to the introduced light, and for outputting a signal proportional to the detected light, the response of the fluorescent indicator varying in accordance with the presence and quantity of an analyte in the medium;

a coil for receiving electrical power from an external power supply, and for communicating said signal to an external processing device; and

a substrate including a circuit component section and a coil section that is separate from the circuit component section, said substrate being formed substantially of ferrite material, said light source and said photodetector being mounted to said circuit component section of said substrate, and said coil being formed around said coil section of said substrate such that said ferrite material increases induction characteristics of said coil.

15. The fluorescence sensor device of claim 14 , wherein said coil extends around opposing surfaces of said substrate.

16. The fluorescence sensor device of claim 14 , wherein said light source comprises a component that is routed through a via formed in said substrate.

17. The fluorescence sensor device of claim 14 , wherein said coil is edge-wrapped around said substrate.

18. The fluorescence sensor device of claim 14 , wherein said coil is used for communication of data signals to an external device.

19. The fluorescence sensor device of claim 14 , wherein said coil is used for inductive reception of electric power from an external power supply.

20. The fluorescence sensor device of claim 14 , wherein said device comprises an implantable sensor device that performs quantitative analyte measurements within a body of a living organism.

21. The fluorescence sensor device of claim 14 , wherein said device comprises an implantable sensor device that performs qualitative analyte measurements within a body of a living organism.

22. The fluorescence sensor device of claim 20 , wherein said light source comprises a light-emitting diode (LED) and said substrate further including at least one photodetector.

23. The fluorescence sensor device of claim 14 , further comprising a via formed in said substrate for routing of a conductor for a circuit component.

Assignments (15)
SECURITY INTEREST Recorded Sep 11, 2023
From: SENSEONICS, INCORPORATED
To: HERCULES CAPITAL, INC.
Reel/Frame 064866/0963 →
RELEASE OF SECURITY INTEREST Recorded Sep 7, 2023
From: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
To: SENSEONICS, INCORPORATED; SENSEONICS HOLDINGS, INC.
Reel/Frame 064834/0962 →
RELEASE OF SECURITY INTEREST Recorded Apr 14, 2023
From: ALTER DOMUS (US) LLC, AS COLLATERAL AGENT
To: SENSEONICS HOLDINGS, INC.; SENSEONICS, INCORPORATED
Reel/Frame 063338/0890 →
RELEASE OF SECURITY INTEREST IN PATENTS AND TRADEMARKS Recorded Aug 14, 2020
From: WILMINGTON SAVINGS FUND SOCIETY, FSB, COLLATERAL AGENT
To: SENSEONICS, INCORPORATED; SENSEONICS HOLDINGS, INC.
Reel/Frame 053498/0275 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 14, 2020
From: SENSEONICS, INCORPORATED
To: ALTER DOMUS (US) LLC, AS COLLATERAL AGENT
Reel/Frame 053496/0292 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT - FIRST LIEN Recorded Apr 24, 2020
From: SENSEONICS, INCORPORATED; SENSEONICS HOLDINGS, INC.
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 052492/0109 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT -SECOND LIEN Recorded Apr 24, 2020
From: SENSEONICS, INCORPORATED; SENSEONICS HOLDINGS, INC.
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 052490/0160 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2020
From: SOLAR CAPITAL LTD., AS AGENT
To: SENSEONICS, INCORPORATED
Reel/Frame 052207/0242 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 1, 2019
From: SENSEONICS, INCORPORATED
To: SOLAR CAPITAL LTD., AS AGENT
Reel/Frame 049926/0827 →
RELEASE OF SECURITY INTEREST Recorded Jul 25, 2019
From: OXFORD FINANCE LLC, AS COLLATERAL AGENT AND AS LENDER
To: SENSEONICS, INCORPORATED
Reel/Frame 049873/0713 →
CHANGE OF NAME Recorded Jun 25, 2019
From: SENSORS FOR MEDICINE AND SCIENCE, INC.
To: SENSEONICS, INCORPORATED
Reel/Frame 049588/0046 →
SECURITY INTEREST Recorded Jan 26, 2018
From: SENSEONICS, INCORPORATED
To: OXFORD FINANCE LLC, AS COLLATERAL AGENT AND AS LENDER
Reel/Frame 045164/0154 →
RELEASE OF SECURITY INTEREST Recorded Dec 12, 2011
From: NEW ENTERPRISE ASSOCIATES 10, LIMITED PARTNERSHIP
To: SENSORS FOR MEDICINE AND SCIENCE, INC.
Reel/Frame 027362/0509 →
SECURITY AGREEMENT Recorded Jan 14, 2011
From: SENSORS FOR MEDICINE AND SCIENCE, INC.
To: NEW ENTERPRISE ASSOCIATES 10, LIMITED PARTNERSHIP
Reel/Frame 025644/0315 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2004
From: COLVIN, ARTHUR E., JR.; GERIG, JOHN S.; ZERWEKH, PAUL SAMUEL; LESHO, JEFFERY C.; MCLEOD, BENJAMIN N.
To: SENSORS FOR MEDICINE AND SCIENCE, INC.
Reel/Frame 015468/0044 →