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App. No. 10/828,202 · Confirmation No. 4337

Semiconductor integrated circuit device and manufacturing method thereof

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2015-12-21 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2006-01-24 ABN Abandonment 2 View
2005-06-10 CTNF Non-Final Rejection 10 View
2005-06-10 1449 List of References cited by applicant and considered by examiner 1 View
2005-06-10 892 List of references cited by examiner 1 View
2005-06-10 FWCLM Index of Claims 1 View
2005-06-10 SRFW Search information including classification, databases and other search related notes 1 View
2005-04-01 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2005-01-31 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-07-15 WFEE Fee Worksheet (SB06) 1 View
2004-07-15 FWCLM Index of Claims 1 View
2004-04-21 TRNA Transmittal of New Application 4 View
2004-04-21 SPEC Specification 35 View
2004-04-21 CLM Claims 10 View
2004-04-21 ABST Abstract 1 View
2004-04-21 DRW Drawings-only black and white line drawings 15 View
2004-04-21 OATH Oath or Declaration filed 4 View
2004-04-21 A.PE Preliminary Amendment 1 View
2004-04-21 SPEC Specification 1 View
2004-04-21 CLM Claims 5 View
2004-04-21 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2004-04-21 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2004-04-21 WFEE Fee Worksheet (SB06) 1 View
2004-04-21 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/828,202
Filed
2004-04-21
Pub. No.
US20040195611A1
Art Unit
2813