IP Library Granted Patent US 7,149,091
Granted Patent B2
US 7,149,091 · App. 10/829,580 · Granted Dec 12, 2006

Electronic circuit device

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Quick Facts
Patent No.
US 7,149,091
App. No.
10/829,580
Granted
Dec 12, 2006
Kind
B2
Abstract

An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.

Claims (32)

1. An electronic circuit device, comprising:

a board on which internal terminals and wirings connected to the internal terminals are formed;

an electronic component that is mounted on the board and is connected with the internal terminals; and

an encapsulation resin with which the electronic component and the internal terminals are encapsulated,

wherein a part of the wiring forms a ring-shaped portion, the ring-shaped portion having a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections, the wiring is connected with a wiring on a rear face of the board via a through hole formed in the board, the through hole being disposed adjacent to an outer edge of the ring-shaped portion, and

wherein the plurality of ring-constituting sections are connected to the respective internal terminals, and the encapsulation resin is in contact with an inner side of the ring-shaped portion.

2. The electronic circuit device according to claim 1 , wherein the ring-shaped portions of the wirings are formed as a multi-ring.

3. The electronic circuit device according to claim 1 ,

wherein the internal terminals are disposed within the ring-shaped portion,

the wirings extend from an outside of the ring-shaped portion to the respective internal terminals so as to be connected thereto via the ring-shaped portion, and

a connecting point of the wiring extending from the internal terminal with the ring-shaped portion and a connecting point of the wiring extending from the outside with the ring-shaped portion are disposed at positions different from each other.

4. The electronic circuit device according to claim 1 , wherein an intersecting portion of the ring-shaped portion and one end of the wiring is shaped like a letter T.

5. The electronic circuit device according to of claim 1 , wherein a part of the wiring is formed so as to divide an inner region of the ring-shaped portion into a region including the internal terminals and a region not including the internal terminals.

6. The electronic circuit device according to claim 1 , wherein, three or more wirings are formed, and at an intersecting portion of the wirings and the ring-shaped portion, two or less line segments are disposed linearly and in parallel from an outside to an inside of the ring-shaped portion.

7. The electronic circuit device according to claim 1 , wherein the wiring extending on the outside of the ring-shaped portion and the ring-shaped portion of the wiring intersect each other at angles of 60° or more.

8. The electronic circuit device according to claim 2 , wherein the gaps provided in the respective wirings of the multi-ring as the ring-shaped portion are disposed so as not to be on a same normal line with respect to the ring-shaped portion.

9. An electronic circuit device, comprising:

a board on which internal terminals and wirings connected to the internal terminals are formed;

an electronic component tat is mounted on the board and is connected with the internal terminals; and

an encapsulation resin with which the electronic component and the internal terminals are encapsulated,

wherein a part of the wiring forms a ring-shaped portion, the ring-shaped portion having a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections, the wiring is connected with a wiring on a rear face of the board via a through hole formed in the board, the through hole being disposed within the ring-shaped portion, and

wherein the plurality of ring-constituting sections are connected to the respective internal terminals, and the encapsulation resin is in contact with an inner side of the ring-shaped portion.

10. The electronic circuit device according to claim 9 , wherein the ring-shaped portions of the wirings are formed as a multi-ring.

11. The electronic circuit device according to claim 9 ,

wherein the internal terminals are disposed within the ring-shaped portion,

the wirings extend from an outside of the ring-shaped portion to the respective internal terminals so as to be connected thereto via the ring-shaped portion, and

a connecting paint of the wiring extending from the internal terminal with the ring-shaped portion and a connecting point of the wiring extending from the outside with the ring-shaped portion are disposed at positions different from each other.

12. The electronic circuit device according to claim 9 , wherein an intersecting portion of the ring-shaped portion and one end of the wiring is shaped like a letter T.

13. The electronic circuit device according to of claim 9 , wherein a part of the wiring is formed so as to divide an inner region of the ring-shaped portion into a region including the internal terminals and a region not including the internal terminals.

14. The electronic circuit device according to claim 9 , wherein three or more wirings are formed, and at an intersecting portion of the wirings and the ring-shaped portion, two or less line segments are disposed linearly and in parallel from an outside to an inside of the ring-shaped portion.

15. The electronic circuit device according to claim 9 , wherein the wiring extending on the outside of the ring-shaped portion and the ring-shaped portion of the wiring intersect each other at angles of 60° or more.

16. The electronic circuit device according to claim 10 , wherein the gaps provided in the respective wirings of the multi-ring as the ring-shaped portion are disposed so as not to be on a same normal line with respect to the ring-shaped portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →
CHANGE OF NAME Recorded Mar 18, 2020
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 052184/0943 →