Sub-micron planar lightwave devices formed on an SOI optical platform
View Patent ↗A set of planar, two-dimensional optical devices is able to be created in a sub-micron surface layer of an SOI structure, or within a sub-micron thick combination of an SOI surface layer and an overlying polysilicon layer. Conventional masking/etching techniques may be used to form a variety of passive and optical devices in this SOI platform. Various regions of the devices may be doped to form the active device structures. Additionally, the polysilicon layer may be separately patterned to provide a region of effective mode index change for a propagating optical signal.
1. An SOI-based optical arrangement for manipulating a propagating planar lightwave signal, the arrangement comprising
a silicon substrate
a dielectric layer disposed over the silicon substrate; and
a single crystal silicon layer disposed over the dielectric layer, the single crystal silicon layer having a thickness of less than one micron (sub-micron) and being etched through in predetermined regions so as to expose the underlying dielectric layer, the refractive index difference between the remaining sub-micron single crystal silicon regions and the etched regions creating interfaces for forming substantially planar optical devices confining the propagating planar lightwave signal as a two-dimensional signal within the confines of the single crystal silicon layer and manipulating the properties of the propagating planar lightwave signal therein, wherein the single crystal silicon layer is etched to create at least one etched region including at least one optically smooth vertical sidewall having a curved surface that intercepts the planar lightwave signal propagating within the single crystal silicon layer, the interface between the remaining sub-micron single crystal silicon and the at least one vertical sidewall creating a planar, two-dimensional reflecting surface for re-directing the planar lightwave signal from propagating in a first direction to propagating in a second direction within the single crystal silicon layer.
2. An SOI-based optical arrangement as defined in claim 1 wherein the at least one vertical sidewall includes a vertical sidewall disposed at a predetermined angle with respect to the planar lightwave signal propagating within the single crystal silicon layer.
3. An SOI-based optical arrangement as defined in claim 2 wherein the vertical sidewall is disposed at an angle of 45° with respect to the propagation direction of the lightwave signal and forms a planar turning minor within the plane of the single crystal silicon layer.
4. An SOI-based optical arrangement as defined in claim 1 wherein the curved surface is a concave surface for focusing the propagating planar light into a predetermined focal point within the single crystal silicon layer.