Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing
View Patent ↗An evaluating pattern includes a conductive pattern formed on a substrate, an insulating layer which is formed on the conductive pattern, a plurality of contact holes formed in a rectangular area through the insulating layer, and a conductive material filled into the contact holes to the conductive pattern.
1. An evaluating pattern comprising:
a semiconductor substrate:
an insulating layer formed on the semiconductor substrate;
a plurality of contact holes formed through the insulating layer in a rectangular area; and
a conductive material filled into the contact holes, wherein the insulating layer has a first thickness in the rectangular area and has a second thickness greater than the first thickness in another area that does not include contact holes.
2. An evaluating pattern according to claim 1 , wherein distances between the contact holes are substantially equal.
3. An evaluating pattern according to claim 1 , wherein the insulating layer is formed of silicon oxide.
4. An evaluating pattern according to claim 1 , wherein the evaluating pattern is formed on a grid line of the semiconductor substrate.
5. An evaluating pattern according to claim 1 , wherein the semiconductor substrate has a conductive pattern formed in the rectangular area.
6. An evaluating pattern according to claim 1 , wherein the conductive material includes at least one of tungsten, titanium and titanium nitride.
7. An evaluating pattern according to claim 1 , wherein a density of the contact holes in the rectangular area is set to correspond to a density of an area in a chip region of the semiconductor substrate which has a greatest density of contact holes.
8. An evaluating pattern according to claim 7 , wherein the density of the contact holes in the rectangular area is about 25%.
9. An evaluating pattern comprising:
a semiconductor substrate having a first rectangular area, a second rectangular area surrounding the first rectangular area and a peripheral area surrounding the second rectangular area;
an insulating layer formed on the semiconductor substrate;
a plurality of contact holes formed through the insulating layer in the second rectangular area, and not in the first rectangular area and the peripheral area; and
a conductive material filled into the contact holes, wherein the insulating layer has a first thickness in the first rectangular area, a second thickness that is less than the first thickness in the second rectangular area, and a third thickness that is greater than the first thickness in the peripheral area.
10. An evaluating pattern according to claim 9 , wherein distances between the contact holes are substantially equal.
11. An evaluating pattern according to claim 9 , wherein the insulating layer is formed of silicon oxide.
12. An evaluating pattern according to claim 9 , wherein the evaluating pattern is formed on a grid line of the semiconductor substrate.
13. An evaluating pattern according to claim 9 , wherein the semiconductor substrate has a conductive pattern formed in the second rectangular area.
14. An evaluating pattern according to claim 9 , wherein the conductive material includes at least one of tungsten, titanium and titanium nitride.
15. An evaluating pattern according to claim 9 , wherein a density of the contact holes in the second rectangular area is set to correspond to a density of an area in a chip region of the semiconductor substrate which has a greater density of contact holes.
16. An evaluating pattern according to claim 15 , wherein the density of the contact holes is about 25%.
17. An evaluating pattern according to claim 9 , wherein the first rectangular area has a width of about 50 μm.
18. An evaluating pattern according to claim 9 , wherein the second rectangular area has a width of about 100 μm.
19. An evaluating pattern comprising:
a semiconductor wafer having a plurality of chip regions and a grid line region separating the chip regions;
an insulating layer formed on the semiconductor wafer;
a plurality of contact holes formed through the insulating layer in a rectangular area; and
a conductive material filled into the contact holes, wherein the insulating layer has a first thickness in the rectangular area and has a second thickness greater than the first thickness in an area that does not include contact holes.
20. An evaluating pattern according to claim 19 , wherein the insulating layer is formed of silicon oxide.