Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization
View Patent ↗A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.
1. A slider assembly comprising a plurality of sliders bonded by a solid debondable encapsulant comprising different first and second polymers such that each slider has an encapsulant-free surface, the encapsulant-free surfaces are coplanar to each other, and the encapsulant is formed via in situ polymerization of an encapsulant fluid, wherein
the encapsulant fluid is comprised of a homogeneous mixture of first and second constituents,
the first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer,
the second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer, and
the first constituent does not substantially react with the second constituent.
2. The slider assembly of claim 1 , wherein the first constituent is comprised of an amine and an epoxide.
3. The slider assembly of claim 2 , wherein the epoxide is a diepoxide.
4. The slider assembly of claim 2 , wherein the amine is a tetraamine.
5. The slider assembly of claim 2 , wherein the amine and the epoxide are present in a stoichiometric ratio.
6. The slider assembly of claim 1 , wherein the first monomer is comprised of an acrylate.
7. The slider assembly of claim 1 , wherein the first polymer is a thermosetting polymer and the second polymer is a thermoplastic polymer.
8. The slider assembly of claim 1 , wherein the second constituent is comprised of the second monomer suitable for in situ polymerization.
9. The slider assembly of claim 8 , wherein the first and second polymers are polymerized via different mechanisms.
10. The slider assembly of claim 9 , wherein the first polymer is polymerized via condensation and the second polymer is polymerized via addition.
11. The slider assembly of claim 10 , wherein the first constituent is comprised of an amine and an epoxide and the second constituent is comprised of an acrylate.
12. The slider assembly of claim 1 , wherein the first polymer is comprised of a linear polymer.
13. The slider assembly of claim 1 , wherein the first polymer is comprised of a branch polymer.
14. The slider assembly of claim 1 , wherein the first polymer is comprised of a network polymer.
15. The slider assembly of claim 13 , wherein the second polymer is comprised of a linear polymer.
16. The slider assembly of claim 14 , wherein the second polymer is comprised of a linear polymer.
17. The slider assembly of claim 1 , wherein the encapsulant is transparent.
18. The slider assembly of claim 1 , having a contiguous planar surface comprised of at least one encapsulant region and containing the coplanar slider surfaces.
19. The slider assembly of claim 18 , wherein the sliders are arranged in an array.
20. The slider assembly of claim 19 , wherein the array is a rectilinear array.
21. The slider assembly of claim 20 , wherein the sliders do not contact each other.
22. The slider assembly of claim 20 , wherein the coplanar surfaces of the sliders are each an air-bearing surface.
23. The slider assembly of claim 22 , further comprising a substrate in contact with the air-bearing surfaces.
24. The slider assembly of claim 23 , wherein the substrate is comprised of a laminate of a flexible tape and an adhesive, wherein the adhesive is in contact with the air-bearing surfaces.
25. The slider assembly of claim 24 , wherein the adhesive is a pressure sensitive adhesive.
26. The slider assembly of claim 24 , wherein the adhesive preferentially adheres to the tape over the air-bearing surfaces.
27. The slider assembly of claim 20 , further comprising a carrier attached to the encapsulant, at least one slider, or both, wherein the carrier does not cover any of the coplanar slider surfaces.
28. The slider assembly of claim 22 , further comprising a resist layer on the air-bearing surfaces, wherein the encapsulant is mechanically stable upon exposure to the resist layer or any component thereof.
29. The slider assembly of claim 28 , wherein the encapsulant is subject to solvation by a solvent not found in the resist layer.
30. A method for forming a slider assembly, comprising:
(a) arranging a plurality of sliders each having a surface such that the surfaces are coplanar to each other;
(b) dispensing an encapsulant fluid to bond the sliders without contacting the coplanar slider surfaces, wherein
the encapsulant fluid is comprised of a homogeneous mixture of first and second constituents,
the first constituent is comprised of a first monomer suitable for in situ polymerization to form a first polymer,
the second constituent is comprised of a second polymer that is different from the first polymer or a second monomer suitable for in situ polymerization to form the second polymer, and
the first constituent does not substantially react with the second constituent; and
(c) effecting in situ polymerization of the encapsulant fluid so as to form a solid debondable polymeric encapsulant comprised of the first and second polymers.
31. The method of claim 30 , wherein the second constituent is comprised of the second monomer suitable for in situ polymerization.
32. The method of claim 31 , wherein step the first and second monomers are simultaneously polymerized in situ during step (c).
33. The method of claim 30 , wherein step (c) is carried out in a temperature range of about 60° C. to about 150° C.
34. The method of claim 33 , wherein step (c) is carried out in a temperature range of about 80° C. to about 120° C.
35. The method of claim 30 , wherein the encapsulant fluid dispensed in step (b) does not contain any solvent.
36. The method of claim 30 , wherein step (a) comprises placing the sliders on a laminate of a flexible tape and an adhesive such that slider surfaces contact the adhesive.
37. The method of claim 36 , wherein the adhesive is resistant or impervious to solvation by the encapsulant fluid.
38. The method of claim 30 , wherein the fluid mixture has an initial viscosity of no more than about 800 centistokes.
39. The method of claim 30 , wherein the initial viscosity is no more than about 500 centistokes.
40. A method for patterning an air-bearing surface of a slider, comprising:
(a) applying a resist layer on an air-bearing surface of a slider, wherein at least a portion of the slider other than the air-bearing surface is encapsulated in a debondable solid encapsulant comprised of different first and second polymers formed via in situ polymerization of an encapsulant fluid, wherein
the encapsulant fluid is comprised of a homogeneous mixture of first and second constituents,
the first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer,
the second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer, and
the first constituent does not substantially react with the second constituent;
(b) removing a portion of the resist layer to uncover a portion of the air-bearing surface in a patternwise manner; and
(c) adding material to and/or removing material from the uncovered portion of the air-bearing surface, thereby patterning the air-bearing surface of the slider,
wherein the encapsulant is mechanically stable upon exposure to any fluid employed in steps (a), (b), and/or (c).
41. The method of claim 40 , further comprising, after step (a) and before step (b), exposing the resist layer to photons in the patternwise manner.