Integrated optical sub-assembly having epoxy chip package
View Patent ↗An optical sub-assembly includes a circuit and one or more electronic components electrically connected to the circuit. One of the electronic components is an optoelectronic device capable of transmitting or receiving light signals. Mounted to a surface of the optoelectronic device is an optical conduit. A first end of the optical conduit mounts to the optoelectronic device and a second end optionally cooperates with an optical component, such as a lens. The optical conduit channels light signals propagating toward or away from the optoelectronic device, while the optical component focuses or collimates such light signals. Securing the optical conduit relative to the optoelectronic device is a protective material such as a resin, epoxy, or other suitable material.
1. An optical sub-assembly comprising:
an optoelectronic device attached to a substrate;
an optical conduit having a first end abutting said optoelectronic device and a second end, said optical conduit optically communicating with said optoelectronic device such that a signal can pass through said optical conduit;
a wire electrically connecting said optoelectronic device to said substrate; and
a protective material substantially encasing all exposed surfaces of said optoelectronic device and said wire, and encasing at least a portion of said optical conduit, such that said protective material does not interfere with said signal.
2. The optical sub-assembly of claim 1 , wherein said optoelectronic device is a laser diode.
3. The optical sub-assembly of claim 1 , further comprising an optical component mounted to said optical conduit.
4. The optical sub assembly of claim 1 , wherein said optoelectronic device is a photodiode.
5. The optical sub-assembly of claim 1 , wherein said first end of said optical conduit is attached to a top of said optoelectronic device.
6. The optical sub-assembly of claim 1 , wherein said first end of said optical conduit is attached to a side of said optoelectronic device.
7. The optical sub-assembly of claim 1 , wherein said substrate is a flexible circuit.
8. The optical sub-assembly of claim 1 , wherein said protective material is a resin.
9. The optical sub-assembly of claim 1 , wherein said protective material is an epoxy.
10. The optical sub-assembly of claim 9 , wherein said epoxy is optically transparent.
11. The optical sub-assembly of claim 1 , further comprising at least one optical coating applied to at least one of said first end and said second end of said optical conduit.
12. An optical sub-assembly comprising:
a laser diode attached to a substrate;
a cylindrical member having a first end abutting said laser diode;
a wire electrically connecting said laser diode to said substrate; and
a protective material substantially encasing all exposed surfaces of said laser diode and said wire, and encasing at least a portion of said cylindrical member, such that said protective material does not interfere with a light signal transmitted from said laser diode.
13. The optical sub-assembly of claim 12 , further comprising an optical component mounted to a second end of said cylindrical member.
14. The optical sub-assembly of claim 13 , wherein said optical component is a lens.
15. The optical sub-assembly of claim 12 , wherein said first end of said cylindrical member is attached to a top of said laser diode.
16. The optical sub-assembly of claim 12 , wherein said first end of said cylindrical member abuts a side of said laser diode.
17. The optical sub-assembly of claim 12 , wherein said substrate is a flexible circuit.
18. The optical sub-assembly of claim 12 , wherein said cylindrical member is a tube comprising any one of a metal, a plastic, an acrylic, a glass, or a composite material.
19. The optical sub-assembly of claim 12 , wherein said protective material is a resin.
20. The optical sub-assembly of claim 12 , wherein said protective material is an epoxy.
21. The optical sub-assembly of claim 20 , wherein said epoxy is optically transparent.
22. An optical sub-assembly comprising:
an optoelectronic device attached to a substrate;
a cylindrical member having a first end abutting said optoelectronic device, said cylindrical member capable of directing an electromagnetic radiation signal either to or from said optoelectronic device;
a wire electrically connecting said optoelectronic device to said substrate;
a transparent material secured to a second end of said cylindrical member; and
a protective material substantially encasing all exposed surfaces of said optoelectronic device and said wire, and encasing at least a portion of said cylindrical member.
23. The optical sub-assembly of claim 22 , wherein said transparent material is a lens.
24. The optical sub-assembly of claim 22 , wherein said first end of said cylindrical member mounts to a top of said photodiode.
25. The optical sub-assembly of claim 22 , wherein said cylindrical member is a tube comprising any one of metal, plastic, acrylic, glass, or a composite material.
26. The optical sub-assembly of claim 22 , wherein said protective material is a resin.
27. The optical sub-assembly of claim 22 , wherein said protective material is an epoxy.
28. The optical sub-assembly of claim 27 , wherein said epoxy is optically transparent.