Seismic data acquisition module
View Patent ↗A seismic data acquisition module includes a motherboard that is environmentally protected as a independent unit by an integral sheath, envelope or encapsulating cover. The motherboard unit is suitably configured for rapid and frequent manual removal from the interior cavity of a protective outer housing for compact and more secure packaging as well as more convenient transport over great distances, if necessary, to successively different survey sites. At a new survey site, the motherboard units may be inserted into more bulky but also more rugged or waterproof outer housings that are provided with environmentally tight cable connectors. The outer housings, having a capital value of only a fraction of the electronic motherboard units, may have arrived at the new site at a different time and may even be distributed in the new survey field at the time the motherboard units arrive.
1. A method of acquiring seismic survey data comprising the steps of:
(a) distributing a plurality of circuitry housing units over a survey grid, said housing units having a cavity therein for confining an electronic motherboard unit;
(b) providing an electronic motherboard unit for at least some of said housing units, each said motherboard unit being interchangeable among similar housing units and having substantially contiguous handling protection for each motherboard unit; and,
(c) providing a selectively connected conduit between said motherboard units and respective signal carrier elements.
2. A method of acquiring seismic survey data as described by claim 1 wherein said motherboard unit is positioned within said cavity after the distribution of said housing units over said survey grid.
3. A method of acquiring seismic survey data as described by claim 1 wherein said motherboard units are transferred from a first survey grid to a second survey grid independently of said housing units.