Method of performing back-end manufacturing of an integrated circuit device
View Patent ↗A method of performing back-end manufacturing of an integrated circuit (IC) device is disclosed. In one method embodiment, the present invention processes a die-strip through a front-of-line assembly portion which comprises a plurality of sub-stations operating on an in-line basis. The die-strip is then automatically provided to an end-of-line assembly portion. The die-strip is then processed through an end-of-line assembly portion which comprises a plurality of sub-stations operating on an in-line basis. The present embodiment then automatically provides the die-strip to a test assembly portion. The die-strip is then tested by the test portion and then automatically provided to a finish assembly portion. The present embodiment then processes the die-strip through a finish portion which comprises a plurality of sub-stations operating on an in-line basis. Camera systems perform automated visual inspection of dies on the die-strip and maintain a database that can be used for automated reject management.
1. A method of performing back-end manufacturing of an integrated circuit (IC) device comprising:
processing a die-strip through a front-of-line assembly portion which comprises a plurality of sub-stations operating on an in-line basis;
processing said die-strip by an end-of-line assembly portion which comprises a plurality of sub-stations operating on an in-line basis; and
processing said die-strip by a finish assembly portion which comprises a plurality of sub-stations operating on an in-line basis.
2. The method as recited in claim 1 wherein said processing said die-strip by said front-of-line assembly portion comprises:
attaching dies to a strip to produce a die-strip using an in-line die attach sub-station;
curing said die-strip using an in-line cure sub-station;
cleaning said die-strip using an in-line plasma sub-station;
bonding said die-strip using an in-line bond sub-station; and
cleaning said die-strip using a second in-line plasma sub-station.
3. The method as recited in claim 2 further comprising employing a camera system for automatic die-strip inspection and quality assurance within said front-of-line assembly portion.
4. The method as recited in claim 2 wherein said front-of-line assembly portion is coupled on an in-line basis with said end-of-line assembly portion and wherein said processing said die-strip by said end-of-line assembly portion comprises:
molding said die-strip using an in-line mold sub-station;
post mold curing said die-strip using an in-line post mold cure sub-station;
attaching said die-strip using an in-line ball attachment sub-station;
sawing said die-strip using an in-line sawing sub-station; and
sorting said sawed die-strip using an in-line sorting sub-station.
5. The method as recited in claim 4 wherein said end-of-line assembly portion is coupled on an in-line basis with said finish assembly portion and wherein said processing said die-strip by said finish assembly portion comprises:
marking die-strip components using an in-line marking sub-station;
performing final visual inspection of said die-strip components using an in-line final visual inspection sub-station; and
processing said die-strip components by an in-line tape and reel sub-station.
6. The method as recited in claim 1 wherein said processing said die-strip by said end-of-line assembly portion comprises:
molding said die-strip using an in-line mold sub-station;
post mold curing said die-strip using an in-line post mold cure sub-station;
attaching said die-strip using an in-line ball attachment sub-station;
sawing said die-strip using an in-line sawing sub-station; and
sorting said sawed die-strip using an in-line sorting sub-station.
7. The method as recited in claim 1 wherein said processing said die-strip by said finish assembly portion comprises:
marking die-strip components using an in-line marking sub-station;
performing final visual inspection of said die-strip components using an in-line automated final visual inspection sub-station; and
processing said die-strip components by an in-line tape and reel sub-station.
8. A method of back-end IC manufacturing comprising:
processing a die-strip through a front-of-line assembly portion which comprises: an in-line die attach sub-station; and an in-line bond sub-station;
processing said die-strip through an end-of-line assembly portion which comprises: an in-line post mold cure sub-station; and an in-line ball attachment sub-station;
processing said die-strip by a test assembly portion; and
processing said die-strip through a finish assembly portion which comprises an in-line final visual inspection assembly sub-station.
9. The method as recited in claim 8 wherein said front-of-line assembly portion further comprises:
a cure sub-station;
a first plasma sub-station; and
a second plasma sub-station.
10. The method as recited in claim 9 wherein said front-of-line assembly portion is coupled in an in-line basis with said end-of-line assembly portion and wherein said end-of-line assembly portion comprises:
a mold sub-station;
a sawing sub-station; and
a sorting sub-station.
11. The method as recited in claim 10 wherein said end-of-line assembly portion is coupled in an in-line basis with said finish assembly portion, said finish assembly portion comprising:
a marking sub-station; and
a tape and reel sub-station.
12. The method as recited in claim 8 wherein said end-of-line assembly portion further comprises:
a mold sub-station;
a sawing sub-station; and
a sorting sub-station.
13. The method as recited in claim 12 further comprising employing a camera system for automated die-strip inspection and quality assurance within said end-of-line assembly portion.
14. The method as recited in claim 8 wherein said finish assembly portion further comprises:
a marking sub-station; and
a tape and reel sub-station.
15. A back-end IC assembly method comprising:
processing a die-strip through a front-of-line portion of an assembly line;
processing said die-strip through an end-of-line portion of said assembly line; and
using in-line processes, performing test and finish assembly on said die-strip to produce a plurality of taped and reeled IC devices from said die-strip.
16. A method as described in claim 15 wherein said front-of-line portion and said end-of-line portion are integrated together and further comprising said front-of-line portion automatically providing said end-of-line portion with said die-strip in an in-line fashion.
17. A method as described in claim 16 wherein said processing said die-strip through said front-of-line portion comprises:
curing said die-strip using an in-line cure sub-station; and
cleaning said die-strip using an in-line plasma sub-station.
18. The method as recited in claim 17 wherein said processing said die-strip through said front-of-line portion further comprises:
attaching dies to a strip to form a die-strip using a die attach sub-station;
bonding said die-strip using an in-line bond sub-station; and
cleaning said die-strip using a second in-line plasma sub-station.
19. A method as described in claim 16 wherein said processing said die-strip through said end-of-line portion comprises:
sawing said die-strip using an in-line sawing sub-station; and
sorting said die-strip using an in-line sorting sub-station.
20. The method as recited in claim 19 wherein said processing said die-strip through said end-of-line portion further comprises:
molding said die-strip using an in-line mold sub-station;
performing post mold curing using an in-line post mold cure sub-station; and
performing ball attachment of said die-strip using an in-line ball attachment sub-station.
21. A method as described in claim 16 wherein said performing finish assembly comprises:
marking components of said die-strip using an in-line marking sub-station; and
processing said components of said die-strip using an in-line tape and reel sub-station.
22. The method as recited in claim 21 wherein said performing finish assembly further comprises performing an automated final visual inspection using an in-line visual inspection sub-station.
23. The method as recited in claim 22 wherein said performing finish assembly further comprises employing a camera system for automated die-strip inspection and quality assurance.
24. A method as described in claim 23 wherein said performing finish assembly uses an in-line finish portion of said assembly line and wherein said in-line finish portion and said test portion are integrated together and further comprising said test portion automatically providing said finish portion with said die-strip in an in-line fashion.
25. A method as described in claim 16 wherein said performing test uses an in-line test portion of said assembly line and wherein said in-line test portion and said end-of-line portion are integrated together and further comprising said end-of-line portion automatically providing said test portion with said die-strip in an in-line fashion.