IP Library Granted Patent US 7,253,615
Granted Patent B2
US 7,253,615 · App. 10/839,095 · Granted Aug 7, 2007

Microelectromechanical system sensor and method for using

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Quick Facts
Patent No.
US 7,253,615
App. No.
10/839,095
Granted
Aug 7, 2007
Kind
B2
Abstract

According to some embodiments, an apparatus includes a movable portion through which a sensing current is to be conducted. The movable portion might comprise, for example, a beam or plate suspended above a well in a Microelectromechanical System (MEMS) substrate. The apparatus may also include a sensing portion coupled to the movable portion, and the movable portion and/or sensing portion may move in a direction normal to the substrate in response to a magnetic field.

Claims (36)

1. An apparatus, comprising:

a substrate having a surface;

a fixed comb mounted to the substrate and disposed generally parallel to the substrate surface;

a movable portion through which a sensing current is to be conducted; and

a comb-like sensing portion coupled to the movable portion and interleaved with the fixed comb, wherein the movable portion moves in a direction normal to the substrate surface in response to a magnetic field to produce a measurement resulting from movement of fingers of the sensing portion with respect to the fixed comb in the normal direction.

2. The apparatus of claim 1 , wherein the substrate is associated with a microelectromechanical system wafer and the movable portion is positioned substantially parallel to the substrate surface.

3. The apparatus of claim 1 , wherein the strength of the magnetic field is to be measured based on a piezoresistance change associated with the sensing portion.

4. The apparatus of claim 1 , wherein the apparatus is a sensor in an array of sensors.

5. The apparatus of claim 1 , wherein the apparatus is at least one of: (i) a magnetic field sensor, and (ii) an electrical current sensor.

6. The apparatus of claim 1 , wherein the suspended plate has a first conducting path and a second conducting path.

7. The apparatus of claim 6 , wherein the sensing current is to move through the two paths in a single direction.

8. The apparatus of claim 6 , wherein the sensing current is to move through the two paths in opposite directions.

9. The apparatus of claim 1 , wherein the strength of the magnetic field is to be measured based on a change in capacitance between the sensing comb and the fixed comb.

10. The apparatus of claim 1 , wherein the strength of the magnetic field is to be measured based on a quality factor change between the sensing comb and the fixed comb.

11. The apparatus of claim 10 , wherein the change in quality factor is determined in connection with at least one of: (i) a resonant frequency, (ii) mutual inductance coupling, and (iii) a mutually inductive voltage.

12. An apparatus, comprising:

a fixed comb;

a movable portion through which a sensing current is to be conducted; and

a comb-like sensing portion coupled to the movable portion and interleaved with the fixed comb, wherein the movable portion moves in response to a magnetic field in two orthogonal directions including a direction normal to a substrate to produce a measurement resulting from movement of fingers of the sensing portion with respect to the fixed comb in the normal direction.

13. The apparatus of claim 12 , wherein the substrate is associated with a microelectromechanical system wafer.

14. The apparatus of claim 12 , wherein the strength of the magnetic field is to be measured based on at least one of: (i) a change in capacitance, (ii) a quality factor change, and (iii) a piezoresistance change.

15. The apparatus of claim 14 , wherein the apparatus is at least one of: (i) a magnetic field sensor, and (ii) an electrical current sensor.

16. A method of sensing an electromagnetic value, comprising:

providing a sensing current through a movable portion of a sensor, the movable portion comprising a comb-like portion interleaved with a fixed comb that is mounted to a substrate and generally parallel to a surface of the substrate; and

measuring an electrical characteristic of the sensing portion coupled to the movable portion when the movable portion moves in a direction normal to the substrate surface in response to a magnetic field to produce a measurement resulting from movement of fingers of the sensing portion with respect to the fixed comb in the normal direction.

17. The method of claim 16 , wherein electrical characteristic is associated with at least one of: (i) a change in capacitance, (ii) a quality factor change, and (iii) a piezoresistance change.

18. The method of claim 17 , further comprising:

determining, based on the measured electrical characteristic, at least one of: (i) a magnetic field value, and (ii) an electrical current value.

19. A system, comprising:

a substrate having a surface;

a fixed comb mounted to the substrate and disposed generally parallel to the substrate surface;

a microelectromechanical system sensor, including:

a movable portion through which a sensing current is to be conducted, and

a comb-like sensing portion coupled to the movable portion and interleaved with the fixed comb, wherein the movable portion moves in a direction normal to the substrate surface in response to a magnetic field to produce a measurement resulting from movement of fingers of the sensing portion with respect to the fixed comb in the normal direction; and

a sensor dependent device.

20. The system of claim 19 , wherein the sensor dependent device is associated with at least one of: (i) a security device, (ii) a medical device, (iii) an electrical controller, (iv) a power distribution device, (v) a power meter, (vi) a circuit breaker, (vii) a consumer device, and (viii) a motor control device.

Assignments (4)
CHANGE OF NAME Recorded Apr 25, 2014
From: GE THERMOMETRICS, INC.
To: AMPHENOL THERMOMETRICS, INC.
Reel/Frame 032763/0141 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2014
From: AMPHENOL CORPORATION
To: GE THERMOMETRICS, INC.
Reel/Frame 032745/0924 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2014
From: GENERAL ELECTRIC COMPANY
To: AMPHENOL CORPORATION
Reel/Frame 032679/0265 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2004
From: BERKCAN, ERTUGRUL; TIAN, WEI-CHENG
To: GENERAL ELECTRIC COMPANY
Reel/Frame 015307/0784 →