Method for manufacturing camera module where a solid state imaging device is an assembly reference plane of an optical unit
View Patent ↗A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.
1. A camera module comprising:
a solid-state imaging device including a semiconductor substrate, on a first surface of which light-receiving elements are formed;
an optical unit having a built-in photographic optical system for forming a subject image on said light-receiving elements;
an electronic component for driving said solid-state imaging device, a first surface of said electronic component being attached to a second surface of said semiconductor substrate, which is opposite to said first surface of said semiconductor substrate, and said electronic component being electrically connected to said solid-state imaging device; and
a circuit board provided with a circuit for driving said solid-state imaging device, said circuit board being attached to a second surface of said electronic component, which is opposite to said first surface of said electronic component, and said circuit board being electrically connected to said solid-state imaging device,
wherein said first surface of said semiconductor substrate is used as an assembly reference plane when said solid-state imaging device and said optical unit are combined.
2. A camera module according to claim 1 , wherein said optical unit is directly attached to said first surface of said semiconductor substrate.
3. A camera module according to claim 1 , further comprising:
a translucent member attached to said first surface of said semiconductor substrate, said translucent member covering only the light-receiving elements.
4. A camera module according to claim 3 , wherein said optical unit is directly attached to said first surface.
5. A camera module according to claim 3 , wherein said translucent member has flatness being identical with that of said semiconductor substrate.
6. A camera module according to claim 5 , wherein said optical unit is attached to said translucent member.
7. A camera module according to claim 1 , wherein said circuit board is a flexible printed circuit board, which is folded to be disposed under said solid-state imaging device.
8. A camera module according to claim 1 , further comprising an opening formed in said circuit board, said opening exposing said translucent member and said assembly reference plane of said semiconductor substrate,
wherein said translucent member is disposed within said opening and breaks the plane of said opening.
9. A camera module according to claim 1 , wherein a photographic optical axis of said photographic optical system coincides with a center of said light-receiving elements.