Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
View Patent ↗A package allowing both electrical and optical coupling between one or more integrated circuits and a printed circuit board (PCB) has an optical waveguide structure in addition to electrical connections. An optically active device is flip-chip bonded directly to an integrated circuit using solder bump technology. The optically active device has a lens directly attached to it to facilitate optical coupling to the optical waveguide. The integrated circuit is flip-chip bonded to a Ball Grid Array (BGA) package. The BGA package is bonded to the PCB using solder reflow technology.
1. An opto-electronic package, comprising:
a substrate;
an optically active device flip-chip bonded to the substrate, wherein the optically active device is selected from the group consisting of a vertical cavity surface emitting laser (VCSEL) having a lens directly attached thereto, an array of vertical cavity surface emitting lasers having a microlens array directly attached thereto, a light emitting diode (LED) having a lens directly attached thereto, a photodetector having a lens directly attached thereto, and an optical modulator having a lens directly attached thereto; and
an integrated circuit bonded to the substrate.
2. The opto-electronic package of claim 1 , wherein the optically active device is flip-chip bonded to the substrate using solder bumps.
3. The opto-electronic package of claim 1 , wherein the substrate is selected from the group consisting of a Ball Grid Array substrate, an organic laminate substrate, and a multi-layer ceramic substrate.
4. The opto-electronic package of claim 1 , wherein the integrated circuit is selected from the group consisting of an optical device driver, a transimpedance amplifier, a microprocessor, a microprocessor chip set, a networking integrated circuit, and a memory.
5. The opto-electronic package of claim 1 , further including a printed circuit board (PCB) bonded to the substrate.
6. The opto-electronic package of claim 5 , wherein the PCB includes a waveguide to propagate light to or from the optically active device.
7. The opto-electronic package of claim 6 , wherein the waveguide includes a holographic element to diffract light to or from the optically active device.
8. The opto-electronic package of claim 6 , wherein the waveguide includes a sloped facet to reflect light to or from the optically active device.
9. The opto-electronic package of claim 5 , wherein the printed circuit board (PCB) is flip-chip bonded to the substrate using solder reflow technology, where solder reflow surface tension pulls the substrate into alignment with the PCB.
10. An opto-electronic package, comprising:
a substrate;
an integrated circuit bonded to the substrate; and
an optically active device with a directly attached optical element flip-chip bonded to the integrated circuit, wherein the optically active device with the directly attached optical element is selected from the group consisting of a vertical cavity surface emitting laser (VCSEL) having a lens directly attached thereto, an array of vertical cavity surface emitting lasers having a microlens array directly attached thereto, a light emitting diode (LED) having a lens directly attached thereto, a photodetector having a lens directly attached thereto, and an optical modulator having a lens directly attached thereto.
11. The opto-electronic package of claim 10 , wherein the substrate is selected from the group consisting of a Ball Grid Array substrate, an organic laminate substrate, and a multi-layer ceramic substrate.
12. The opto-electronic package of claim 10 , wherein the optically active device with the directly attached optical element is flip-chip bonded to the integrated circuit using solder bumps.
13. The opto-electronic package of claim 10 , wherein the integrated circuit is selected from the group consisting of an optical device driver, a transimpedance amplifier, a microprocessor, a microprocessor chip set, a networking integrated circuit, and a memory.
14. The opto-electronic package of claim 10 , further including a printed circuit board (PCB) bonded to the substrate.
15. The opto-electronic package of claim 14 , wherein the PCB includes a waveguide to propagate light to or from the optically active device.
16. The opto-electronic package of claim 15 , wherein the waveguide includes a holographic element to diffract light to or from the optically active device.
17. The opto-electronic package of claim 15 , wherein the waveguide includes a sloped facet to reflect light to or from the optically active device.
18. The opto-electronic package of claim 14 , wherein the printed circuit board (PCB) is flip-chip bonded to the substrate using solder reflow technology, where solder reflow surface tension pulls the substrate into alignment with the PCB.
19. An opto-electronic package, comprising:
a substrate;
an optically active device with a directly attached optical element flip-chip bonded to the substrate, wherein the optically active device with the directly attached optical element is selected from the group consisting of a vertical cavity surface emitting laser (VCSEL) having a lens directly attached thereto, an array of vertical cavity surface emitting lasers having a microlens array directly attached thereto, a light emitting diode (LED) having a lens directly attached thereto, a photodetector having a lens directly attached thereto, and an optical modulator having a lens directly attached thereto; and
an integrated circuit bonded to the substrate.
20. The opto-electronic package of claim 19 , wherein the optically active device is flip-chip bonded to the substrate using solder bumps.
21. The opto-electronic package of claim 19 , wherein the substrate is selected from the group consisting of a Ball Grid Array substrate, an organic laminate substrate, and a multi-layer ceramic substrate.
22. The opto-electronic package of claim 19 , wherein the integrated circuit is selected from the group consisting of an optical device driver, a transimpedance amplifier, a microprocessor, a microprocessor chip set, a networking integrated circuit, and a memory.
23. The opto-electronic package of claim 19 , further including a printed circuit board (PCB) bonded to the substrate.
24. The opto-electronic package of claim 23 , wherein the PCB includes a waveguide to propagate light to or from the optically active device.
25. The opto-electronic package of claim 24 , wherein the waveguide includes a holographic element to diffract light to or from the optically active device.
26. The opto-electronic package of claim 24 , wherein the waveguide includes a sloped facet to reflect light to or from the optically active device.
27. The opto-electronic package of claim 23 , wherein the printed circuit board (PCB) is flip-chip bonded to the substrate using solder reflow technology, where solder reflow surface tension pulls the substrate into alignment with the PCB.