Optoelectronic module and method for producing an optoelectronic module
View Patent ↗The invention relates to an optoelectronic module having at least one leadframe, at least one carrier element connected to the leadframe, and at least one optoelectronic component connected to the carrier element, which component can emit and/or receive light. The invention furthermore relates to a method for producing an optoelectronic module that includes providing at least one leadframe, at least one carrier element and at least one optoelectronic component, connecting the optoelectronic component to the carrier element and connecting the carrier element to the leadframe, and at least partly encapsulating the optoelectronic component, the carrier element and the leadframe with a plastic.
1. An optoelectronic module, comprising:
a leadframe having a top surface and a bottom surface with an aperture extending from the top surface to the bottom surface and electrical contact areas on the bottom surface;
a carrier element having a substantially transparent body with a top surface and a bottom surface and having its bottom surface being located on the top surface of the leadframe and covering the aperture; and
an optoelectronic component having a top surface and a light emitting and/or receiving bottom surface and having its bottom surface being located on the top surface of the carrier element so as to be oriented over the aperture of the leadframe, wherein the optoelectronic component is electrically connected to the leadframe and is oriented to emit and/or receive light through the body of the carrier element and through the aperture of the leadframe,
wherein the leadframe, the carrier element and the optoelectronic component are surrounded at least partly with a plastic, and
wherein the body of the carrier element comprises a material that is substantially transparent at least with respect to the light emitted and/or received by the optoelectronic component.
2. The optoelectronic module as claimed in claim 1 , wherein the plastic comprises a substantially nontransparent material at least with respect to the light emitted and/or received by the optoelectronic component.
3. The optoelectronic module as claimed in claim 1 , wherein the electrical contact areas of the leadframe are tin-coated at least one surface and, together with the plastic, forms a surface-mountable component.
4. The optoelectronic module as claimed in claim 1 , wherein at least one surface of the carrier element is arranged in a plane of a surface of the leadframe.
5. The optoelectronic module as claimed in claim 1 , wherein at least one surface of the carrier element is arranged in a plane of a surface of the leadframe, and wherein the at least one region of the carrier element is not surrounded with plastic, wherein the carrier element is arranged as an exposed die at the surface thereof.
6. The optoelectronic module as claimed in claim 5 , wherein the region of the carrier element which is not surrounded with plastic is configured to facilitate light entry and/or exit to and/or from the module, respectively.
7. The optoelectronic module as claimed in claim 1 , wherein the carrier element comprises semiconductor material.
8. The optoelectronic module as claimed in claim 1 , further comprising at least one further electronic component connected to the leadframe.
9. The optoelectronic module as claimed in claim 8 , wherein at least one surface of the further electronic component is arranged in a plane of a surface of the leadframe.
10. The optoelectronic module as claimed in claim 8 , wherein the at least one further electronic component comprises at least one region which is not surrounded with plastic, wherein the at least one further electronic component is arranged as an exposed die.
11. The optoelectronic module as claimed in claim 1 , wherein the carrier element comprises at least one lens configured to focus light which is emitted by the optoelectronic component and/or radiates onto the optoelectronic component.
12. The optoelectronic module as claimed in claim 11 , wherein the lens is arranged in a recessed portion in the carrier element.
13. The optoelectronic module as claimed in claim 11 , wherein the lens comprises a plane, diffractive lens.
14. The optoelectronic module as claimed in claim 1 , wherein the carrier element and/or the optoelectronic component are electrically connected to the leadframe via at least one bonding wire.
15. The optoelectronic module as claimed in claim 1 , wherein the optoelectronic component comprises a semiconductor laser chip and/or a semiconductor photodetector.
16. The optoelectronic module as claimed in claim 1 , wherein the carrier element comprises an optoelectronic detector.
17. The optoelectronic module as claimed in claim 1 , further comprising at least one receptacle for an optical plug or an optical fiber arranged in the region of the opening of the leadframe.
18. The optoelectronic module as claimed in claim 17 , wherein the receptacle comprises an alignment region, which interacts with the opening of the leadframe to align the receptacle relative to the leadframe.
19. The optoelectronic module as claimed in claim 18 , wherein the receptacle comprises an optical lens.
20. The optoelectronic module as claimed in claim 1 , wherein the leadframe and/or the carrier element are arranged on a substantially flexible printed circuit board.
21. The optoelectronic module as claimed in claim 20 , further comprising electrical connections associated with the flexible printed circuit board in electrical contact with the optoelectronic component.
22. The optoelectronic module as claimed in claim 21 , wherein the electrical connections comprise pins or plugs.
23. The optoelectronic module as claimed in claim 21 , wherein the electrical connections are arranged in a first region of the flexible printed circuit board which is arranged essentially perpendicular to a second region thereof at which the leadframe and/or the carrier element are arranged.
24. The optoelectronic module as claimed in claim 20 , wherein the printed circuit board comprises an opening through which light can pass.
25. The optoelectronic module as claimed in claim 1 , further comprising an electrical shielding overlying a portion of the at least one optoelectronic component.
26. The optoelectronic module as claimed in claim 25 , wherein the electrical shielding comprises a shielding plate.
27. The optoelectronic module as clamed in claim 25 , wherein the leadframe, carrier element, and optoelectronic component of the optoelectronic module are substantially completely surrounded by the electrical shielding.
28. The optoelectronic module as claimed in claim 25 , wherein the leadframe and/or the carrier element are arranged on a printed circuit board and an electrical shielding is arranged around the leadframe and/or the carrier element, a portion of the shielding passing through the printed circuit board.
29. The optoelectronic module as claimed in claim 1 , wherein the plastic fixes a position of the carrier relative to the leadframe.
30. The optoelectronic module as claimed in claim 1 , wherein the optoelectronic component is flip-chip mounted to the carrier element.
31. An optoelectronic module, comprising:
a leadframe having a top surface and a bottom surface with an aperture extending from the top surface to the bottom surface and electrical contact areas on the bottom surface;
a carrier element having a body with a top surface and a bottom surface located on the top surface of the lead frame and covering the aperture; and
an optoelectronic component having a top surface and a light emitting and/or receiving bottom surface bottom surface located on the top surface of the carrier element so as to be oriented over the aperture of the leadframe, wherein the optoelectronic component is electrically connected to the leadframe and arranged on the carrier element such that the carrier element is positioned between the leadframe and the optoelectronic component,
wherein the optoelectronic component is oriented to emit and/or receive light through the aperture of the lead frame and the body of the carrier element, and where the carrier element is substantially transparent at least to the light emitted and/or received by the optoelectronic component.
32. The optoelectronic module as claimed in claim 31 , further comprising a film covering the aperture in the leadframe so as to prevent contamination of the opening prior to operational use of the optoelectronic module.
33. The optoelectronic module as claimed in claim 31 , wherein the aperture in the leadframe is sized and configured to receive a correspondingly sized optical fiber receptacle, and wherein the aperture is positioned to optically align an optical fiber received by the optical fiber receptacle with the optoelectronic component.