Multilayer wiring board, method of mounting components, and image pick-up device
View Patent ↗A multilayer wiring board on which multiple components are overlappingly mounted. The multilayer wiring board includes: a first surface on which a first component among the multiple components is mounted; and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.
1. A multilayer wiring board on which a plurality of components are overlappingly mounted, the multilayer wiring board comprising:
a first surface on which a first component among the multiple components is mounted; and
a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, a second component among the multiple components being mounted on the second surface to partially overlap the first component in a non-contact manner, the second surface also having a light-transmitting window through which light is transmitted.
2. The multilayer wiring board of claim 1 , wherein the multilayer wiring board is formed by a plurality of stacked unit boards, and the first and second surfaces are formed at surfaces of the stacked unit boards.
3. The multilayer wiring board of claim 1 , wherein the step is provided at an inner side of the first surface in a surface direction of the first surface.
4. The multilayer wiring board of claim 2 , wherein the step is provided at an inner side of the first surface in a surface direction of the first surface.
5. The multilayer wiring board of claim 1 , wherein a height of the step is greater than a thickness of the second component.
6. The multilayer wiring board of claim 2 , wherein a height of the step is greater than a thickness of the second component.
7. The multilayer wiring board of claim 3 , wherein a height of the step is greater than a thickness of the second component.
8. The multilayer wiring board of claim 4 , wherein a height of the step is greater than a thickness of the second component.
9. A multilayer wiring board comprising:
a first stack with a light-transmitting window formed therein through which light is transmitted;
a second stack with an opening formed therein at a position at which light transmitted through the light-transmitting window can be transmitted through the opening, the second stack being disposed over the first stack, by which a step is provided between the first stack and the second stack;
and a component which is electrically connected to a surface of the second stack to at least partially cover the opening.
10. An image pick-up device including a multilayer wiring board on which a plurality of components are overlappingly mounted, the image pick-up device comprising:
a multilayer wiring board which includes a first surface on which at least one component among the multiple components is mounted and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, the second surface having a light-transmitting window through which light is transmitted;
an image sensor mounted on the second surface to receive light transmitted through the light-transmitting window;
a first component mounted on the first surface partially overlapping the image sensor in a non-contact manner; and
a lens unit disposed at a position at which light from a subject transmitted through the light-transmitting window can be focused on a light-receiving surface of the image sensor.
11. The image pick-up device of claim 10 , wherein the multilayer wiring board is formed by a plurality of stacked unit boards and the first and second surfaces are formed at surfaces of the stacked unit boards.
12. The image pick-up device of claim 10 , wherein the first component makes contact with the first surface at one end portion thereof and overlaps the image sensor in a non-contact manner at another end portion thereof.
13. The image pick-up device of claim 11 , wherein the first component makes contact with the first surface at one end portion thereof and overlaps the image sensor in a non-contact manner at another end portion thereof.
14. The image pick-up device of claim 10 , wherein a height of the step is greater than a thickness of the image sensor.
15. The image pick-up device of claim 11 , wherein a height of the step is greater than a thickness of the image sensor.
16. The image pick-up device of claim 12 , wherein a height of the step is greater than a thickness of the image sensor.
17. The image pick-up device of claim 13 , wherein a height of the step is greater than a thickness of the image sensor.
18. An image pick-up device comprising:
a multilayer wiring board which includes a first stack with a light-transmitting window formed therein through which light is transmitted, and a second stack with an opening formed therein at a position at which the opening at least partially overlaps the light-transmitting window, the second stack being disposed over the first stack, by which a step is provided between the first stack and the second stack, and a component which is electrically connected to a surface of the second stack to at least partially cover the opening;
an image sensor mounted on the first stack to receive light transmitted through the light-transmitting window and the opening; and
a lens unit disposed at a position at which light from a subject transmitted through the light-transmitting window can be focused on a light-receiving surface of the image sensor.
19. A method of overlappingly mounting a plurality of components on a multilayer wiring board, the method comprising:
mounting an image sensor on a second surface of a multilayer wiring board to receive light coming in through the light-transmitting window, the multilayer wiring board including a first surface on which at least one component among the multiple components is mounted, and a second surface whose height in a thickness direction of the multilayer wiring board is smaller than that of the first surface, by which a step is provided between the first surface and the second surface, the second surface having a light-transmitting window through which light is transmitted; and
mounting a first component on the first surface at a position at which the first component partially overlaps the image sensor in a non-contact manner.
20. The method of claim 19 , wherein the first component is electrically connected to the first surface at one end portion thereof and overlaps the image sensor in a non-contact manner at another end portion thereof.