LED assembly with vented circuit board
View Patent ↗A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.
1. A circuit board LED display assembly, comprising:
a plurality of modules, each module including at least two light-emitting diodes (LEDs), the modules disposed in a grid pattern at junctions connected by adjacent bridges defining air vents there between; and
a multilayered substrate having a thermally conductive layer in thermal communication with the LEDs.
2. The circuit board LED display assembly according to claim 1 , wherein the multilayered substrate further includes an insulating layer over the thermally conductive layer; the insulating layer having a plurality of openings configured for air communication with the thermally conductive layer; the insulating layer further including apertures permitting said thermal communication between the LEDs and the thermally conductive layer.
3. The circuit board LED display assembly according to claim 2 , wherein said openings are disposed in a sidewall of the bridges for exposing a portion of the thermally conductive layer.
4. The circuit board LED display assembly according to claim 1 , wherein each of the modules has a base member disposed on the multilayer substrate and the base member is in thermal communication with the thermally conductive layer.
5. The circuit board LED display assembly according to claim 4 , wherein the base member includes at least one extension member abutting the thermally conductive layer for thermal communication.
6. The circuit board LED display assembly according to claim 1 , wherein the bridges are formed from a portion of the multilayer substrate.