Semiconductor light emitting apparatus and method for producing the same
View Patent ↗A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.
1. A semiconductor light emitting apparatus, comprising:
a non-conductive sub mount;
a metal layer provided on the sub mount;
a solder material member provided on the metal layer; and
a semiconductor light emitting device die-bonded to the metal layer by the solder material member;
wherein:
a surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed;
the solder material attachment area is electrically connected to the metal layer exposed area;
the solder material attachment area is larger than a die-bond area of the semiconductor light emitting device; and
a metal layer removed area adjacent the light emitting device is surrounded on all lateral sides thereof by the metal layer.
2. A semiconductor light emitting apparatus according to claim 1 , wherein the solder material attachment area is distanced from the metal layer removed area by a prescribed distance.
3. A semiconductor light emitting apparatus according to claim 1 , wherein the metal layer removed area is L-shaped, I-shaped, generally U-shaped, V-shaped or arc-shaped.
4. A semiconductor light emitting apparatus according to claim 1 , further comprising a wire which is wire-bonded to the metal layer exposed area via a wire-bonding section, such that the metal layer removed area is located between the wire-bonding section and the solder material attachment area.
5. A semiconductor light emitting apparatus according to claim 1 , wherein the sub mount is formed of a material having a high heat conductivity and a low wettability with respect to a solder material of the solder material member.
6. A semiconductor light emitting apparatus according to claim 5 , wherein the sub mount is formed of SIC, AlN or sapphire.
7. A semiconductor light emitting apparatus according to claim 1 , wherein the metal layer includes a Ti layer, a Pt layer or a Ni layer, and an Au layer which are laminated in this order from a surface of the sub mount.
8. A semiconductor light emitting apparatus according to claim 1 , wherein the semiconductor light emitting device has at least one light emitting point.
9. A semiconductor light emitting apparatus according to claim 1 , further comprising another semiconductor light emitting device.