Film pattern formation method, device and method for manufacturing the same, electro-optical device, electronic device, and method for manufacturing active matrix substrate
View Patent ↗A method for forming a film pattern on a substrate includes the steps of: forming banks on the substrate; and making liquid drops of functional liquid land on the substrate to dispose the liquid drops in an area partitioned by the banks, wherein a spacing between the liquid drops are determined so that the liquid drops connect together after they land on the substrate, and a position in which a liquid drop of the liquid drops which lands the closest to an end of the area is spaced from the end of the area by less than a half of the spacing between the liquid drops.
1. A method for forming a film pattern on a substrate comprising the steps of:
forming banks on the substrate; and
making liquid drops of functional liquid land on the substrate to dispose the liquid drops in an area partitioned by the banks,
wherein a spacing between the liquid drops are determined so that the liquid drops connect together after they land on the substrate, and
a position in which a liquid drop of the liquid drops which lands the closest to an end of the area is spaced from the end of the area by less than a half of the spacing between the liquid drops.
2. The film pattern formation method according to claim 1 , wherein the distance between a position in which a liquid drop which is located closest to one end of the area is landed and the one end of the area is y/2, where “d” is a length of the area, “h” is the spacing between the liquid drops, and “y” is a remainder obtained by dividing “d” by “h”.
3. The film pattern formation method according to claim 1 , wherein the functional liquid includes electrically conductive particles.
4. The film pattern formation method according to claim 1 , wherein the functional liquid develops electrical conductivity by thermal treatment or irradiation with light.
5. A method for manufacturing a device in which a film pattern is formed on a substrate comprising the step of: forming the film pattern on the substrate with the film pattern formation method according to claim 1 .
6. A method for manufacturing an active matrix substrate, comprising:
a first step of forming a gate lead line on a substrate;
a second step of forming a gate insulation layer on the gate lead line;
a third step of forming a semiconductor layer on the gate insulation layer;
a fourth step of forming a source electrode and a drain electrode on the gate insulation layer;
a fifth step of disposing an insulation material on the source electrode and the drain electrode; and
a sixth step of forming a pixel electrode which is electrically connected to the drain electrode,
wherein in at least one of the first, fourth, and sixth steps the film pattern formation method according to claim 1 is used.
7. The film pattern formation method according to claim 1 , wherein the end of the area has a short side and a long side, the end of the area being defined by the short side.
8. The method for manufacturing a device according to claim 5 , wherein a switching device is provided on the substrate, and the film pattern is a constituent of the switching device.
9. A device which is manufactured using the method for manufacturing a device according to claim 5 .
10. An electro-optical device comprising the device according to claim 9 .
11. An electronic device comprising the electro-optical device according to claim 10 .
12. A method for forming a film pattern on a substrate comprising the steps of:
forming a liquid repelling layer in a predetermined pattern which is endowed with liquid repellency to functional liquid on the substrate;
disposing the functional liquid in an area partitioned by the liquid repelling layer,
wherein a spacing between the liquid drops are determined so that the liquid drops connect together after they land on the substrate, and
a position in which a liquid drop of the liquid drops which lands the closest to an end of the area is spaced from the end of the area by less than a half of the spacing between the liquid drops.
13. The film pattern formation method according to claim 12 , wherein the distance between a position in which a liquid drop which is located closest to one end of the area is landed and the one end of the area is y/2, where “d” is a length of the area, “h” is the spacing between the liquid drops, and “y” is a remainder obtained by dividing “d” by “h”.
14. The film pattern formation method according to claim 12 , wherein the functional liquid includes electrically conductive particles.
15. The film pattern formation method according to claim 12 , wherein the functional liquid develops electrical conductivity by thermal treatment or irradiation with light.
16. A method for manufacturing a device in which a film pattern is formed on a substrate comprising the step of: forming the film pattern on the substrate with the film pattern formation method according to claim 12 .
17. A method for manufacturing an active matrix substrate, comprising:
a first step of forming a gate lead line on a substrate;
a second step of forming a gate insulation layer on the gate lead line;
a third step of forming a semiconductor layer on the gate insulation layer;
a fourth step of forming a source electrode and a drain electrode on the gate insulation layer;
a fifth step of disposing an insulation material on the source electrode and the drain electrode; and
a sixth step of forming a pixel electrode which is electrically connected to the drain electrode,
wherein in at least one of the first, fourth, and sixth steps the film pattern formation method according to claim 10 is used.
18. The film pattern formation method according to claim 12 , wherein the end of the area has a short side and a long side, the end of the area being defined by the short side.
19. The method for manufacturing a device according to claim 16 , wherein a switching device is provided on the substrate, and the film pattern is a constituent of the switching device.
20. A device which is manufactured using the method for manufacturing a device according to claim 16 .
21. An electro-optical device comprising the device according to claim 20 .
22. An electronic device comprising the electro-optical device according to claim 21 .