IP Library › Granted Patent US 6,954,987
Granted Patent B2
US 6,954,987 · App. 10/849,478 · Granted Oct 18, 2005

Method of interconnecting a circuit board to a substrate

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Quick Facts
Patent No.
US 6,954,987
App. No.
10/849,478
Granted
Oct 18, 2005
Kind
B2
Abstract

A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.

Claims (16)

1. A method of interconnecting a printed circuit board, having a via hole and a vent hole, and a conductive substrate, the method comprising:

coupling the substrate to the printed circuit board using a nonconductive adhesive layer, the adhesive layer having a space forming a cavity between the substrate and the printed circuit board aligned to the via hole and vent hole; and

reflowing solder from a top surface of the printed circuit board through the via hole to electrically connect the printed circuit board to the conductive substrate while relieving pressure in the cavity by venting gases in the cavity through the vent hole in the printed circuit board.

2. The method of interconnecting a printed circuit board to a substrate of claim 1 , further comprising plating the via hole before the reflowing.

3. The method of interconnecting a printed circuit board to a substrate of claim 1 , wherein the substrate is made from a metal material and wherein the substrate provides electrical grounding and heat dissipation for the printed circuit board through the reflowed solder.

4. The method of interconnecting a printed circuit board to a substrate of claim 1 , wherein the adhesive layer is an epoxy layer.

5. The method of interconnecting a printed circuit board to a substrate of claim 4 , wherein the epoxy layer is a thermal set epoxy and the method comprises curing the epoxy at an elevated temperature.

6. A method of assembling and electrically coupling a metal substrate to an RF printed circuit board, the method comprising:

providing a printed circuit board having a via hole, a vent hole adjacent the via hole, one or more RF power transistors and one or more conductive traces;

providing a conductive metal substrate;

providing a nonconductive layer between the printed circuit board and substrate the nonconductive layer having an opening below the via hole and vent hole thereby forming a cavity;

surface applying solder paste to the via hole; and

heating and reflowing the solder paste from the top surface of the printed circuit board through the via hole and opening in the nonconductive layer to electrically connect the conductive trace to the conductive metal substrate while relieving pressure in the cavity by venting gases in the cavity through the vent hole.

7. The method of assembling and electrically coupling a conductive substrate to an RF printed circuit board of claim 6 , wherein the conductive metal substrate is made from copper.

8. The method of assembling and electrically coupling a conductive substrate to an RF printed circuit board of claim 6 , wherein the nonconductive layer comprises an epoxy layer and the method further comprises bonding the printed circuit board to the conductive substrate using the nonconductive epoxy layer.

9. The method of assembling and electrically coupling a conductive substrate to an RF printed circuit board of claim 6 , wherein the conductive trace is an RF ground connection.