Method of producing thin-film device, electro-optical device, and electronic apparatus
View Patent ↗The invention provides a transfer technique by which the dimensional precision of a thin-film device is not deteriorated, even if the device is produced by transferring a fine structure or a thin-film circuit layer onto a substrate with an inferior shape-stability. The method includes: forming a fine structure or a thin-film circuit layer on a first substrate using a photolithographic patterning process; shifting the fine structure or the thin-film circuit layer from the first substrate onto a second substrate, or shifting the fine structure or the thin-film circuit layer from the first substrate onto the second substrate via a third substrate; and forming a thin-film pattern on the fine structure or the thin-film circuit layer shifted onto the second substrate by a non-photolithographic method.
1. A method of manufacturing an active matrix substrate, comprising:
providing a substrate including a wiring on the substrate;
forming a plurality of transistors and a terminal electrically connecting the transistors on the substrate; and
disposing an electroconductive material using a non-photolithographic method such that the electroconductive material connects the wiring to the terminal.
2. The method of manufacturing an active matrix substrate according to claim 1 , the substrate being a soft or flexible substrate.
3. The method of manufacturing an active matrix substrate according to claim 1 , the non-photolithographic method including at least one of a liquid-droplet jetting method, a printing method, a mask-evaporation method, and a bonding method accompanied by positioning process.
4. The method of manufacturing an active matrix substrate according to claim 1 , the substrate being a soft or flexible substrate.
5. The method of manufacturing an active matrix substrate according to claim 1 , the non-photolithographic method being a liquid-droplet jetting method.
6. The method of manufacturing an active matrix substrate according to claim 1 , the non-photolithographic method being a printing method.
7. The method of manufacturing an active matrix substrate according to claim 1 , the non-photolithographic method being a mask-evaporation method.
8. The method of manufacturing an active matrix substrate according to claim 1 , the non-photolithographic method being a bonding method accompanied by positioning process.
9. The method of manufacturing an active matrix substrate according to claim 1 , the electroconductive material being a paste of silver.
10. A method of manufacturing an active matrix substrate, the method comprising:
forming a plurality transistors and a terminal through which a power source voltage is supplied to the plurality of transistors, the plurality of transistors and the terminal being disposed in a circuit area of a base member on which a wiring is formed between the circuit area and an edge or edges constituting an outline of the base member;
forming a connection between the wiring and the terminal by a non-photolithographic method.