Process for producing an integrated electronic circuit comprising superposed components and integrated electronic circuit thus obtained
View Patent ↗A process for producing an integrated electronic circuit. The process begins with the production of a first electronic component and a second electronic component that are superposed on top of a substrate. A volume of temporary material is formed on the substrate at the position of the second electronic component. The first electronic component is then produced above the volume of temporary material relative to the substrate, and then the second electronic component is produced using at least one shaft for access to the temporary material. The first electronic component may be an active component and the second electronic component may be a passive component.
1. A process for producing an integrated circuit, comprising:
forming a volume of temporary material on a substrate;
forming a first electronic component above the volume of temporary material, on an opposite side of the volume of temporary material from the substrate;
forming at least one access shaft from a surface of the integrated circuit and the volume of temporary material;
removing at least part of the temporary material via the access shaft so as to hollow-out at least a portion of the volume of temporary material; and
subsequent to forming the first electronic component, forming a second electronic component in the portion of the volume of temporary material which has been hollowed-out by introducing at least one material via the access shaft.
2. The process according to claim 1 , further comprising:
heating the integrated circuit produced prior to forming the second electronic component.
3. A process for porducing an integrated circuit, comprising:
forming a volume of temporary meterial on a substrate;
forming a first electronic component above the volume of temporary material, wherein forming the first electronic component further comprises a wafer bonding of a substantially single-crystal semiconductor material to the integrated circuit, on an opposite side of the volume of temporary material from the substrate;
forming at least one access shaft from a surface of the integrated circuit and the volume of temporary material;
removing at least part of the temporary material via the access shaft so as to hollow-out at least a portion of the volome of temporary material; and
forming a second electronic component in the portion of the volume of temporary material which has been hollowed-out by introducing at least one material via the access shaft.
4. A process for producing an integrated circuit, comprising:
forming a volume of temporary material on a substrate;
forming a first electronic component above the volume of temporary material, on an opposite side of the volume of temporary material from the substrate;
forming at least one access shaft from a surface of the integrated circuit and the volume of temporary material;
removing at least part of the temporary material via the access shaft so as to hollow-out at least a portion of the volume of temporary material;
forming a second electronic component in the portion of the volume of temporary material which has been hollowed-out by introducing at least one material via the access shaft; and
forming a volume of electrically insulating material after forming of the volume of temporary material, wherein the volume of electrically insulating material is placed above the volume of temporary material relative to the substrate and in such a way that the volume of electrically insulating material is located in a final circuit between the first electronic component and the second electronic component.
5. The process according to claim 4 , wherein removing at least part of the temporary material via the access shaft is performed by etching isotropically.
6. The process according to claim 4 , wherein removing at least part of the temporary material via the access shaft is performed using a solution which does not degrade the electrically insulating material.
7. The process according to claim 1 , further comprising:
forming an isolating sheath portion around at least one portion of the access shaft.
8. The process according to claim 1 , wherein the second electronic component comprises a passive component.
9. The process according to claim 1 , wherein the second electronic component comprises a passive component formed using chemical vapor deposition.
10. The process according to claim 1 , wherein the first electronic component comprises an active component.
11. A process for producing an integrated circuit comprising:
forming a volume of temporary material on a substrate;
forming an active electronic component above the volume of temporary material, wherein the forming the active electronic component comprises a wafer bonding of a substantially single-crystal semiconductor material to the integrated circuit, on an opposite side of the volume of temporary material from the substrate, and wherein at least part of the active electronic component is formed in a part of the substantially single-crystal semiconductor material;
forming at least one access shaft from a surface of the integrated circuit and the volume of temporary material;
removing at least part of the temporary material via the access shaft so as to hollow-out at lest a portion of the volume of temporary material; and
forming a second electronic component in the portion of the volume of temporary material which has been hollowed-out by introducing at least one material via the access shaft.
12. The process according to claim 11 , further comprising:
forming a volume of electrically insulating material after the forming a volume of temporary material, wherein the volume of electrically insulating material is placed above the volume of temporary material relative to the substrate and in such a way that the volume of electrically insulating material is located in a final circuit between the active electronic component and the second electronic component.
13. The process according to claim 12 , further comprising:
heating the integrated circuit produced prior to forming a second electronic component.
14. The process according to claim 3 , further comprising:
heating the integrated circuit produced prior to the forming the second electronic component.
15. The process according to claim 3 , further comprising:
forming of an isolating sheath portion around at least one portion of the access shaft.
16. The process according to claim 3 , wherein the second electronic component comprises a passive component.
17. The process according to claim 8 , wherein the second electronic component comprises a passive component formed using chemical vapor deposition.
18. The process according to claim 4 , wherein the first electronic component comprises an active component.