Integrated stacked capacitor and method of fabricating same
View Patent ↗An integrated stacked capacitor comprises a first capacitor film ( 46 ) of polycrystalline silicide (poly), a second capacitor film ( 48 ) and a first dielectric ( 26 ) sandwiched between the first capacitor film ( 46 ) and second capacitor film ( 48 ). A second dielectric ( 34 ) and a third capacitor film ( 50 ) are provided. The second dielectric ( 34 ) is sandwiched between the second capacitor film ( 48 ) and third capacitor film ( 50 ). A method for fabrication of an integrated stacked capacitor comprises the following sequence of steps: applying a polysilicide layer ( 20 ) to form the first capacitor film ( 46 ); applying a first dielectric ( 26 ); applying a first metallization layer ( 28 ) to form the second capacitor film ( 48 ); applying a second dielectric ( 34 ); and applying a second metallization layer ( 34 ) to form the third capacitor film ( 50 ).
1. An integrated stacked capacitor comprising:
a first capacitor film of polycrystalline silicide (poly), wherein said first capacitor film is arranged on an oxide-nitride-oxide layer sequence which is in turn arranged on a lower polysilicide layer;
a second capacitor film;
a first dielectric sandwiched between said first capacitor film and said second capacitor film;
a second dielectric; and
a third capacitor film, wherein said second dielectric is sandwiched between said second capacitor film and said third capacitor film.
2. The capacitor as set forth in claim 1 , wherein said second capacitor film comprises titanium nitride or a titanium alloy.
3. The capacitor as set forth in claim 1 , wherein said third capacitor film comprises titanium nitride or a titanium alloy.
4. The capacitor as set forth in claim 1 , wherein said first dielectric comprises a nitride and said second dielectric comprises an oxide.
5. The capacitor as set forth in claim 1 , wherein said first dielectric and said second dielectric each comprise a nitride.
6. The capacitor as set forth in claim 1 , wherein said first dielectric and said second dielectric each comprise an oxide.
7. The capacitor as set forth in claim 1 , wherein said second capacitor film is connected to a contact connecting a metallization layer from which said third capacitor film is also formed.