Polyamide molding compositions
View Patent ↗A thermoplastic molding composition comprising polyamide is disclosed. The composition that contains vinyl (co)polymer and an optional solvent is useful in application where inhibited crystallization of polyamide is desirable, including laser-welding.
1. A method for manufacturing films for the packaging sector, comprising:
producing a molding composition including,
A) 90–99.995 wt % polyamide,
B) 0.005–5 wt. % vinyl (co)polymer, and
C) greater than 0 to 5 wt. % solvent, the wt. % all
occurrences being relative to the weight of the
composition is used; and
forming a film from the molding composition.
2. A method according to claim 1 , wherein A) is present in an amount of 95–99.994 wt. %, B) is present in an amount of 0.005–1 wt % and C) is present in an amount of 0.001–1 wt. %.
3. A method according to claim 1 , wherein A) is present in an amount of 99–99.965 wt. % and B) is present in an amount of 0.005–0.8 wt. % and C) is present in an amount of 0.03–0.4 wt. %.
4. A method according to claim 1 further containing at least one member selected from the group consisting of fillers, reinforcing fillers, conventional additives and colorants.
5. A method according to claim 1 wherein B) is at least one member selected from the group consisting of poly-N-vinyllactam, poly-Nvinylpyrrolklone copolymers of vinyllactam and copolymers of vinylpyrrolidone.
6. A method according to claim 1 wherein A) is polyamide 6.
7. A method according to claim 1 wherein the solvent is a member selected from the group consisting of water, alcohol, ketone, glacial acetic acid, chlorinated hydrocarbon and phenol.