Chemical vapor deposition apparatus and method
View Patent ↗Chemical vapor deposition apparatus and method are provided with coating gas distribution and exhaust systems that provide more uniform coating gas temperature and coating gas flow distribution among a plurality of distinct coating zones disposed along the length of a coating chamber.
1. A method of chemical vapor deposition, comprising flowing coating gas in a gas distribution conduit in a coating chamber, discharging the coating gas laterally from the gas distribution conduit to an annular manifold located about the gas distribution conduit laterally between the gas distribution conduit and an annular coating zone and having gas flow openings of the manifold communicated to the coating zone, and exhausting spent coating gas from the coating zone through openings in an annular baffle located about and outwardly of the coating zone.
2. A method of chemical vapor deposition, comprising flowing coating gas in a gas distribution conduit in a heated coating chamber, discharging the coating gas from the gas distribution conduit laterally through gas discharge openings at an opposing manifold wall of an empty manifold disposed laterally between a coating zone and said gas distribution conduit, and flowing the coating gas through a plurality of gas flow openings disposed in the manifold wall to the coating zone with the gas flow openings being out of alignment with said gas discharge openings such that there is no line-of-sight gas flow path from said gas discharge openings to said gas flow openings through said empty manifold to the coating zone.