Optoelectronic housings and methods of assembling optoelectronic packages
View Patent ↗Optoelectronic housings and methods of assembling optoelectronic packages are disclosed. An example of such an optoelectronic package includes an optoelectronic module having a substrate, a first optical fiber extending in a first direction from the substrate, and a second optical fiber extending from the substrate in a second direction opposite the first direction. It also includes a body defining a chamber dimensioned to receive the optoelectronic module, and an optical fiber feedthrough fixed to a first side of the body for receiving the first optical fiber. A bore is defined in a second side of the body opposite the first side of the body. The bore is positioned to receive the second optical fiber. A second optical fiber feedthrough is threaded onto the second optical fiber and slid into the bore after the second optical fiber is positioned in the bore. The second feedthrough is then secured to the body.
1. A method of assembling an optoelectronic package comprising:
locating an optoelectronic module in a housing, the optoelectronic module having a first optical fiber and a second optical fiber; and
after the optoelectronic module is located within the housing, coupling a feedthrough to the housing such that one of the first and second optical fibers extends through the feedthrough and a first end of the feedthrough is located within the housing and a second end of the feedthrough is located external to the housing.
2. A method as defined in claim 1 further comprising threading the feedthrough onto the one of the first and second optical fibers.