IP Library Granted Patent US 7,717,627
Granted Patent B2
US 7,717,627 · App. 10/852,991 · Granted May 18, 2010

Electrical component connector with misalignment compensation

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Quick Facts
Patent No.
US 7,717,627
App. No.
10/852,991
Granted
May 18, 2010
Kind
B2
Abstract

A transceiver module is provided that includes an optical subassembly having an extension with traces corresponding to traces defined on an associated transceiver substrate. A connector element including a flexible, non-electrically conductive substrate within which is disposed an array of conductors is placed between overlapping portions of the extension and the transceiver substrate so that upper ends of some of the conductors contact the traces of the extension, while lower ends of those same conductors contact the corresponding traces of the transceiver substrate. In this way, the connector element provides electrical communication between the optical subassembly and transceiver substrate, while also accommodating misalignment that may be present, or develop, in the transceiver module components.

Claims (12)

1. An optoelectronic module, comprising:

a transceiver substrate including at least one trace;

an optical subassembly including at least one trace that is configured and arranged for at least indirect electrical communication with the at least one trace of the transceiver substrate; and

a connector element at least partially sandwiched between a surface of the transceiver substrate where the at least one trace of the transceiver substrate is disposed and a surface of an extension of the optical subassembly upon which the at least one trace of the optical subassembly is etched, the connector element comprising:

a flexible, substantially non-electrically conductive substrate having first and second opposing sides; and

an array of conductors disposed within the flexible substrate, extending from the first side to the second side opposite to the first side through a width of the flexible substrate, and being distributed substantially uniformly throughout a substantial portion of the flexible substrate, at least one conductor of the array of conductors being in electrical communication with both a trace of the transceiver substrate and a trace of the optical subassembly disposed on opposing sides of the flexible substrate sandwiching the flexible substrate directly between at least a portion of the transceiver substrate and extension, wherein each conductor of the array of conductors extends substantially through upper and lower surfaces of the flexible substrate.

2. The optoelectronic module as recited in claim 1 , wherein the optical subassembly comprises one of a transmit optical subassembly; and, a receive optical subassembly.

3. The optoelectronic module as recited in claim 1 , wherein the at least one conductor defines a predetermined angle in cooperation with an axis that is substantially perpendicular to the opposing sides of the flexible substrate.

4. The optoelectronic module as recited in claim 1 , wherein the at least one conductor defines opposing sides, each of which is at least flush with a corresponding opposing side of the flexible substrate.

5. The optoelectronic module as recited in claim 1 , wherein the at least one conductor substantially comprises gold.

6. The optoelectronic module as recited in claim 1 , wherein the flexible substrate substantially comprises a silicone rubber compound.

7. The optoelectronic module as recited in claim 1 , wherein the transceiver substrate comprises a printed circuit board.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →