Electronic component
View Patent ↗An electronic component has a casing having a resin injecting section having at least one wall. At least one circuit board is housed in the casing, next to the resin injecting section via the wall. At least one lead terminal is provided in the casing. The lead terminal has a first end and a second end, and a middle section connected between the first and second ends. The first end of the lead terminal is connected to the circuit board in a way that the middle section of the lead terminal is provided as straddling the wall of the resin injecting section. Also provided is at least one lead wire having a third end and a fourth end. The third end of the lead wire is connected to the second end of the lead terminal in the resin injecting section. The fourth end of the lead wire is pulled out from the casing. The third end of the lead wire and the second end of the lead terminal connected to each other are embedded in resin injected in the resin injecting section whereas the middle section of the lead terminal straddling the wall of the resin injecting section is not embedded in the resin. Instead of straddling the wall of the resin injecting section, the middle section of the lead terminal may be inserted into an opening provided on the wall and connected to the circuit board.
1. An electronic component comprising:
a casing;
at least one circuit board housed in the casing;
a resin injecting section provided in the casing, the resin injecting section having at least one wall that partitions the casing into a section in which the circuit board is housed and the resin injecting section;
at least one lead terminal having a first end and a second end, and a middle section connected between the first and second ends, the first end of the lead terminal being connected to the circuit board in a way that the middle section of the lead terminal is provided as straddling the wall of the resin injecting section; and
at least one lead wire having a third end and a fourth end, the third end of the lead wire being connected to the second end of the lead terminal in the resin injecting section, the fourth end of the lead wire being pulled out from the casing, the third end of the lead wire and the second end of the lead terminal connected to each other being embedded in resin injected in the resin injecting section whereas the circuit board and the first end of the lead terminal are not embedded in the resin.
2. The electronic component according to claim 1 further comprising a plurality of circuit boards, lead terminals and lead wires, the circuit boards being housed in parallel in the casing, next to the resin injecting section via the wall, each lead terminal having the first end and the second end, and the middle section connected between the first and second ends, the first end of each lead terminal being connected to the corresponding circuit board in a way that the middle section of each lead terminal is provided as straddling the wall, each lead wire having the third end and the fourth end, the third end of each lead wire being connected to the second end of the corresponding lead terminal in the resin injecting section, the fourth end of each lead wire being pulled out from the casing, the third end of each lead wire and the second end of the corresponding lead terminal connected to each other being embedded in the resin whereas the middle section of each lead terminal straddling the wall is not embedded in the resin.
3. An electronic component comprising:
a casing;
at least one circuit board housed in the casing;
a resin injecting section provided in the casing, the resin injecting section having at least one wall that partitions the casing into a section in which the circuit board is housed and the resin injecting section;
at least one lead terminal having a first end and a second end, and a middle section connected between the first and second ends, the first end of the lead terminal being connected to the circuit board, the middle section of the lead terminal being inserted into an opening provided on the wall of the resin injecting section; and
at least one lead wire having a third end and a fourth end, the third end of the lead wire being connected to the second end of the lead terminal in the resin injecting section, the fourth end of the lead wire being pulled out from the casing, the third end of the lead wire and the second end of the lead terminal connected to each other being embedded in resin injected in the resin injecting section whereas the circuit board and the first end of the lead terminal are not embedded in the resin.
4. The electronic component according to claim 3 , wherein the middle section of the lead terminal inserted into the opening is embedded in the resin while the opening is applied with a sealant.
5. The electronic component according to claim 3 further comprising a plurality of circuit boards, lead terminals and lead wires, the circuit boards being housed in parallel in the casing, next to the resin injecting section via the wall, each lead terminal having the first end and the second end, and the middle section connected between the first and second ends, the first end of each lead terminal being connected to the corresponding circuit board, the middle section of each lead terminal being inserted into the opening, each lead wire having the third end and the fourth end, the third end of each lead wire being connected to the second end of the corresponding lead terminal in the resin injecting section, the fourth end of each lead wire being pulled out from the casing, the third end of each lead wire and the second end of the corresponding lead terminal connected to each other being embedded in resin injected in the resin injecting section.
6. The electronic component according to claim 5 , wherein the middle section of each lead terminal inserted into the opening is embedded in the resin while the opening is applied with a sealant.