Method for manufacturing quartz oscillator
A method for manufacturing quartz oscillators is provided which permits quartz oscillators having an oscillation frequency, as designed, to be obtained with small variation of individual oscillation frequency and with high reliability. The method for manufacturing quartz oscillators according to the present invention comprises the steps of forming a first resist layer ( 300 ) on one surface of a quartz substrate ( 100 ), exposing said first resist layer to light of a first amount of exposure to form a patterned first masking layer ( 210 ), forming a second resist layer ( 400 ) on the other surface of said quartz substrate, exposing said second resist layer to light of a second amount of exposure via said quartz substrate to form a patterned second masking layer ( 410 ) by using said first masking layer, and etching said quartz substrate to form quartz pieces ( 150 ) by using said patterned first masking layer and said patterned second masking layer.
1. A method for manufacturing a quartz oscillator comprising the steps of:
forming a first resist layer on one surface of a quartz substrate;
exposing said first resist layer to light of a first amount of exposure so as to expose a part of said first resist layer in a first exposure step;
forming a patterned first masking layer by developing said exposed first resist layer;
forming a second resist layer on the other surface of said quartz substrate;
exposing said second resist layer to light of a second amount of exposure via said quartz substrate to form a patterned second masking layer by using said patterned first masking layer in a second exposure step; and
etching said quartz substrate to cut out quartz pieces by using said patterned first masking layer and said patterned second masking layer.
2. A method for manufacturing a quartz oscillator according to claim 1 , wherein said first amount of exposure and said second amount of exposure are selected such that the pattern of said patterned first masking layer and the pattern of said patterned second masking layer have substantially the same shape.
3. A method for manufacturing a quartz oscillator according to claim 1 , wherein said first masking layer has corrosion resistance to the etching solution for etching said quartz substrate.
4. A method for manufacturing a quartz oscillator according to claim 1 , wherein the step of forming said patterned second masking layer includes the step of forming said patterned second masking layer by removing the portion of said second resist layer that has been exposed to light.
5. A method for manufacturing a quartz oscillator according to claim 4 , wherein said second resist layer is formed of a photosensitive material which has corrosion resistance to the etching solution for etching said quartz substrate, and of which the portion exposed to light is dissolved and removed.
6. A method for manufacturing a quartz oscillator according to claim 1 , further comprising the step of:
forming, between said second resist layer and said quartz substrate, a transparent masking layer which has transparency and has corrosion resistance to the etching solution for etching said quartz substrate.
7. A method for manufacturing a quartz oscillator according to claim 6 , wherein the step of forming said patterned second masking layer includes the steps of:
forming a patterned second resist layer by removing the portion of said second resist layer which has been exposed to light; and
patterning the transparent masking layer to form said patterned second masking layer by using said patterned second resist layer as a mask.
8. A method for manufacturing a quartz oscillator according to claim 1 , wherein the step of forming said patterned second masking layer includes the steps of:
forming a patterned second resist layer by removing the portion of said resist layer other than the portion exposed to light;
forming the second masking layer over said patterned second resist layer; and
removing said patterned second resist layer to form said patterned second masking layer.
9. A method for manufacturing a quartz oscillator according to claim 1 , further comprising the step of:
forming a film masking layer between said second resist layer and said quartz substrate.
10. A method for manufacturing a quartz oscillator according to claim 9 , wherein the step of forming said patterned second masking layer includes the steps of:
removing the portion of said second resist layer which has been exposed to light to form a patterned second resist layer; and
patterning the film masking layer to form said patterned second masking layer by using said patterned second resist layer as a mask.
11. A method for manufacturing a quartz oscillator according to claim 10 , wherein said film masking layer is a laminated film including an Au film and a Cr film.
12. A method for manufacturing a quartz oscillator according to claim 11 , wherein said film masking layer has light transmittance of 0.4%–1.7%.
13. A method for manufacturing a quartz oscillator according to claim 11 , wherein said Au film has a film thickness of 0.06–0.10 μm.
14. A method for manufacturing a quartz oscillator according to claim 11 , wherein said Cr film has a film thickness of 0.01–0.05 μm.
15. A method for manufacturing a quartz oscillator according to claim 1 , further comprising the steps of:
attaching electrodes to said quartz piece; and
mounting said quartz piece having electrodes attached thereto in a container.
16. A method for manufacturing a quartz oscillator according to claim 1 , wherein said first amount of exposure and said second amount of exposure are determined separately.
17. A method for manufacturing a quartz oscillator according to claim 1 , wherein said first amount of exposure and said second amount of exposure are determined so that said patterned first masking layer and said patterned second masking layer have the same shape.