IP Library Granted Patent US 7,306,822
Granted Patent B2
US 7,306,822 · App. 10/854,446 · Granted Dec 11, 2007

Products comprising nano-precision engineered electronic components

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Quick Facts
Patent No.
US 7,306,822
App. No.
10/854,446
Granted
Dec 11, 2007
Kind
B2
Abstract

Electronic devices prepared from nanoscale powders are described. Methods for utilizing nanoscale powders and related nanotechnology to prepare capacitors, inductors, resistors, thermistors, varistors, filters, arrays, interconnects, optical components, batteries, fuel cells, sensors and other products are discussed.

Claims (46)

1. A method for manufacturing a product comprising one or more passive electronic components, wherein the method comprises:

providing ceramic nanopowders;

suspending the nanopowders in a solvent thereby preparing a nanopowder dispersion or paste;

forming a layer from the nanopowder dispersion or paste such that the average grain size of the nanopowder in the layer is equal to or less than 100 nanometers; and

wherein the layer provides at least one passive electronic device function selected from the group consisting of capacitor, resistor, varistor and inductor; and

processing the layer into one or more passive electronic components.

2. The method of claim 1 wherein the ceramic nanopowders comprise an oxide.

3. The method of claim 1 wherein the ceramic nanopowders composition comprises two or more metals.

4. The method of claim 1 wherein the dispersion or paste comprises a polymeric composition of matter.

5. The method of claim 1 wherein the product comprises an electrode and the layer is formed on the electrode.

6. The method of claim 1 wherein the layer is a nanocomposite.

7. The method of claim 1 wherein the product comprises a multilayer device.

8. The method of claim 1 wherein the product comprises a device array.

9. The method of claim 1 wherein the product comprises interconnects.

10. The method of claim 1 wherein the product comprises multiple layers.

11. The method of claim 1 wherein the layer comprises polymer.

12. The method of claim 1 wherein the layer has a thickness less than 1 micron.

13. The method of claim 5 wherein the electrode comprises Pt, Pd, Au, Ag, Cu or Ni.

14. A method for manufacturing a product comprising one or more device components, wherein the method comprises:

providing ceramic nanopowders;

dispersing the nanopowders in a solvent thereby preparing a nanopowder dispersion or paste;

forming a layer from the nanopowder dispersion or paste such that the average grain size of the nanopowder in the layer is equal to or less than 100 nanometers; and

wherein the layer provides at least one device function selected from the group consisting of electromagnetic coupling, thermistor, piezo-device, magnetic device and interconnect; and

processing the layer into one or more passive electronic device components.

15. A method for manufacturing a product comprising one or more device components, wherein the method comprises:

providing ceramic nanopowders;

dispersing the nanopowders in a solvent thereby preparing a nanopowder dispersion or paste;

forming a layer from the nanopowder dispersion or paste such that the average grain size of the nanopowder in the layer is equal to or less than 100 nanometers; and

wherein the layer provides at least one device function selected from the group consisting of photoelectric device, thermoelectric device, ion-conducting electrolyte, battery, fuel cell and sensor; and

processing the layer into one or more passive electronic device components.

16. A method for manufacturing a product comprising one or more device components, wherein the method comprises:

providing ceramic nanopowders;

dispersing the nanopowders in a solvent thereby preparing a nanopowder dispersion or paste;

forming a layer from the nanopowder dispersion or paste such that the average grain size of the nanopowder in the layer is equal to or less than 100 nanometers; and

wherein the layer provides at least one device function selected from the group consisting of optical device, magneto-optical device, biomedical device and membrane device; and

processing the layer into one or more passive electronic device components.

17. A product prepared using the method of claim 1 .

18. A product prepared using the method of claim 14 .

19. A product prepared using the method of claim 15 .

20. A product prepared using the method of claim 16 .

21. A method for manufacturing a product comprising one or more passive electronic components, wherein the method comprises:

providing ceramic nanopowders;

preparing a nanopowder dispersion or paste comprising the ceramic nanopowders;

forming a layer from the nanopowder dispersion or paste such that the average grain size of the nanopowder in the layer is equal to or less than 100 nanometers; and

wherein the layer provides at least one device function; and

processing the layer into one or more passive electronic components.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2008
From: NANOPRODUCTS CORPORATION
To: PPG INDUSTRIES OHIO, INC.
Reel/Frame 020540/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2007
From: YADAV, TAPESH; HU, HONGXING
To: NANOPRODUCTS CORPORATION
Reel/Frame 019450/0264 →