IP Library › Granted Patent US 7,144,754
Granted Patent B2
US 7,144,754 · App. 10/856,777 · Granted Dec 5, 2006

Device having resin package and method of producing the same

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Quick Facts
Patent No.
US 7,144,754
App. No.
10/856,777
Granted
Dec 5, 2006
Kind
B2
Abstract

A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

Claims (12)

1. A method of producing devices respectively having chips sealed by resin packages, said method comprising:

(a) forming a lead frame having a base having recess portions respectively having metallic films;

(b) mounting chips on the lead frame;

(c) providing connecting parts which electrically connect electrode pads of said chips and the metallic films at said recess portions;

(d) molding resin so that molded resin packages respectively cover the chips and metallic films supported by the lead frame; and

(e) separating from the lead frame the molded resin packages together with the metallic films provided to resin projections which are counterparts of said recess portions.

2. The method as claimed in claim 1 , wherein said step (e) comprises a step of etching the lead frame and thereby dissolving the lead frame.

3. The method as claimed in claim 1 , wherein said step (e) comprises a step of mechanically separating the lead frame from the molded resin packages and the metallic films.

4. The method as claimed in claim 1 , further comprising a step of providing a tape member to the molded resin packages before said step (e) is executed.

5. The method as claimed in claim 1 , wherein said step (c) comprises a first step of providing bonding balls to the metallic films, and a second step of bonding wires to electrode pads of the chip and said bonding balls, said bonding balls and said bonding wires corresponding to said connecting parts.

6. The method as claimed in claim 1 , wherein said step (d) molds the resin so that the molded resin packages are joined together.

7. The method as claimed in claim 1 , wherein said step (d) molds the resin so that the molded resin packages are separated from each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →