Electronic equipment
The electronic equipment includes a housing accommodating an electronic circuit used in the operation of the device and a high-frequency circuit for wireless communication related to the operation of the device. A dielectric antenna is mounted on the rear surface of the housing near a lateral end thereof. Since the electronic circuit for operation and the high-frequency circuit for wireless communication are provided in the housing, it is not necessary to connect a personal computer and a mobile telephone by a cable thus making the device mobile. Further, since the dielectric antenna connected to the high-frequency circuit is mounted on the rear surface of the housing, the antenna characteristics can be improved and stabilized.
1. Electronic equipment comprising:
a dielectric antenna having a surface formed with a conductor pattern having a predetermined shape;
a substrate having a first surface and a second surface,
said dielectric antenna being mounted on said first surface; and
a coaxial connector mounted on said second surface of said substrate;
said substrate having a ground pattern between said dielectric antenna and said coaxial connector, wherein:
said ground pattern comprises first and second ground patterns formed on said first and second surfaces of said substrate, respectively; said first and second ground patterns being connected by a via extending through said substrate.
2. Electronic equipment according to claim 1 , wherein:
said conductor pattern of said dielectric antenna comprises first and second conductor patterns; said first conductor pattern being connected to said first ground pattern; said coaxial connector comprising a signal terminal and a ground terminal; said ground terminal being connected to said second ground pattern; said second conductor pattern of said dielectric antenna and said signal terminal of said coaxial connector being connected by a feeder pattern formed on said substrate.
3. Electronic equipment according to claim 1 , further comprising:
a housing on which said substrate is mounted, said housing being formed of a conductor said second ground pattern of said substrate being connected to said housing.