Ball Grid Array package having integrated antenna pad
An apparatus for an improved Ball Grid Array (BGA) package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a BGA package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupled to the radio frequency (RF) input or output, and the antenna pad is structured to reduce the inductance of the BGA package. The antenna pad may include a pad disposed above the semiconductor device, a pad disposed to the side of the semiconductor device, or an antenna chip. An antenna may be coupled to the antenna pad. The antenna may include a trace antenna, a staggered antenna, or a helical antenna.
1. A Ball Grid Array (BGA) package, comprising:
a substrate;
a semiconductor device disposed on the substrate and including a pad defining an input or output of a radio frequency (RF) circuit included in the semiconductor device;
a mold compound disposed on the substrate and completely encapsulating the semiconductor device; and
an antenna pad located to one side of the semiconductor device and electrically coupled to the pad of the semiconductor device by a single conductive element; and
where the antenna pad is external to the mold compound.
2. The package of claim 1 ,
further comprising ball connections disposed underneath the substrate, and an antenna electrically coupled to the antenna pad; and
where the antenna pad is coupled to the antenna without the use of the ball connections.
3. The package of claim 1 , the antenna pad disposed under the substrate.
4. The package of claim 1 , the antenna pad embedded within the substrate.
5. The package of claim 1 where an antenna is electrically coupled to the antenna pad, and the antenna is helical shaped.
6. The package of claim 1 where the antenna pad is a surface mounted antenna chip.
7. The package of claim 1 where the antenna pad is configured for attaching an antenna.
8. The package of claim 1 where the antenna pad and the single conductive element are covered by a protective coating separate from the mold compound.
9. The package of claim 8 where the protective coating is selected based, at least in part, on RF properties.
10. The package of claim 8 where the protective coating is selected based, at least in part, on mechanical properties.