Granted Patent B1

US 6,982,864 · App. 10/864,309 · Granted Jan 3, 2006

Abstract

Claims (92)

1. A capacitor comprising a copper termination, said copper termination made by firing a lead-free and cadmium-free ink including a glass component, said glass component comprising:

a. up to about 65 mole % ZnO;

b. about 0.1 to about 61 mole % B 2 O 3 ;

c. about 0.1 to about 63 mole % SiO 2 ; and

d. wherein the ratio of B 2 O 3 to SiO 2 is from about 0.7 to about 5.

2. The capacitor of claim 1 wherein the glass component comprises:

a. up to about 51 mole % SrO;

b. up to about 17 mole % Al 2 O 3 ;

c. up to about 40 mole % BaO+CaO; and

d. up to about 20 mole % MgO.

3. The capacitor of claim 2 wherein the molar ratio of B 2 O 3 to SiO 2 in the glass component is about 0.7 to about 3.

4. The capacitor of claim 2 wherein the glass component comprises about 5 to about 60 mole % B 2 O 3 +SiO 2 .

5. The capacitor of claim 4 wherein the glass component excludes alkali oxides.

6. The capacitor of claim 1 wherein the glass component comprises:

a. about 20 to about 60 mole % ZnO,

b. up to about 49 mole % SrO,

c. about 0.1 to about 61 mole % B 2 O 3 ,

d. about 0.1 to about 17 mole % Al 2 O 3 ,

e. about 0.1 to about 63 mole % SiO 2 ,

f. up to about 40 mole % BaO+CaO,

g. up to about 20 mole % MgO,

h. wherein the ratio of B 2 O 3 to SiO 2 is from about 0.7 to about 3.

7. The capacitor of claim 6 wherein the glass component comprises about 5 to about 60 mole % B 2 O 3 +SiO 2 .

8. The capacitor of claim 6 wherein the glass component comprises about 25 to about 35 mole % BaO+CaO.

9. The capacitor of claim 6 wherein the glass component comprises about 5 to about 15 mole % MgO.

10. The capacitor of claim 6 , wherein the glass component further comprises about 0.1 to about 30 mole % CuO.

11. The capacitor of claim 8 further comprising 2-15 mole % Li 2 O+Na 2 O+K 2 O+Rb 2 O+Cs 2 O+Fr 2 O.

12. The capacitor of claim 1 wherein the glass component comprises:

a. about 0.1 to about 65 mole % ZnO,

b. about 0.1 to about 51 mole % SrO,

c. about 0.1 to about 61 mole % B 2 O 3 ,

d. about 0.1 to about 17 mole % Al 2 O 3 ,

e. about 0.1 to about 63 mole % SiO 2 ,

f. about 0.1 to about 40 mole % BaO+CaO,

g. about 0.1 to about 20 mole % MgO.

13. The capacitor of claim 1 wherein the glass component comprises:

a. about 10 to about 56 mole % ZnO,

b. about 0.1 to about 49 mole % SrO,

c. about 15 to about 35 mole % B 2 O 3 ,

d. about 0.1 to about 17 mole % Al 2 O 3 ,

e. about 1 to about 35 mole % SiO 2 ,

f. about 0.1 to about 35 mole % BaO+CaO,

g. about 0.1 to about 15 mol % MgO,

h. wherein the ratio of B 2 O 3 to SiO 2 is from about 0.8 to about 4

i. wherein the ink has a viscosity of about 20,000 to about 30,000 centipoise.

14. The capacitor of claim 1 wherein the glass component comprises:

a. about 40 to about 60 mole % ZnO,

b. 0 mole % SrO,

c. about 20 to about 30 mole % B 2 O 3 ,

d. about 0.2 to about 15 mole % Al 2 O 3 ,

e. about 10 to about 25 mole % SiO 2 ,

f. about 1 to about 15 mole % MgO,

g. wherein the glass component excludes alkali oxides,

h. wherein the molar ratio of B 2 O 3 to SiO 2 is from about 1.0 to about 1.8,

i. wherein the ink has a viscosity of about 15,000 to about 35,000 centipoise.

15. A lead-free and cadmium-free ink for forming a conductive copper pathway, said ink including a glass component and a metal component, said glass component comprising:

a. up to about 65 mole % ZnO,

b. about 0.1 to about 61 mole % B 2 O 3 ,

c. about 0.1 to about 63 mole % SiO 2 ,

d. wherein the molar ratio of B 2 O 3 to SiO 2 is about 0.7 to about 5

e. wherein the ink has a viscosity of about 15,000 to about 35,000 centipoise, and

f. wherein said ink comprises by weight from about 1 to about 22 percent by weight of said glass component.

16. The ink of claim 15 , wherein the glass component further comprises:

a. about 0.1 to about 20 mole % MgO, and the molar ratio of B 2 O 3 to SiO 2 is about 0.7 to about 4, and

b. said ink comprises from about 55 to about 85 percent by weight of said metal component.

17. The ink of claim 15 , wherein the glass component further comprises BaO and CaO, wherein the total of BaO+CaO is about 0.1 to about 40 mole %.

18. The ink of claim 15 , wherein the glass component further comprises:

a. about 0.1 to about 51 mole % SrO,

b. about 0.1 to about 17 mole % Al 2 O 3 .

19. The ink of claim 18 , wherein the glass component further comprises:

a. about 1 to about 17 mole % Al 2 O 3 ,

b. about 0.1 to about 20 mole % CuO.

20. The capacitor of claim 18 wherein the glass component comprises:

a. about 45 to about 65 mole % ZnO,

b. about 10 to about 35 mole % B 2 O 3 ,

c. about 1 to about 20 mole % SiO 2 ,

d. about 0.1 to about 20 mole % MgO,

e. about 0.1 to about 5 mole % Al 2 O 3 ,

f. wherein the molar ratio of B 2 O 3 to SiO 2 is about 0.7 to about 2.5.

21. The ink of claim 15 wherein said glass component further comprises:

a. about 0.1 to about 20 mole % CO 3 O 4 +MnO 2 , and

b. about 0.1 to about 17 mole % La 2 O 3 +Y 2 O 3 +Ga 2 O 3 .

22. A process for making a multilayer ceramic chip capacitor having end terminations comprising:

a. forming a green chip by stacking alternating layers of a dielectric material and a conductive electrode material,

b. firing the green chip to form a multilayer ceramic chip capacitor body,

c. applying a conductive lead-free and cadmium-free ink to the ceramic chip capacitor body, said ink comprising a glass component, said glass component comprising:

i. up to about 65 mole % ZnO,

ii. about 0.1 to about 61 mole % B 2 O 3 ,

iii. about 0.1 to about 63 mole % SiO 2 ,

iv. wherein the ratio of B 2 O 3 to SiO 2 is from about 0.7 to about 5, and

v. wherein the ink has a viscosity of about 15,000 to about 35,000 centipoise; and,

d. post-firing the chip and forming the conductive end terminations.

Assignments (14)