Tamper-free and forgery-proof passport and methods for providing same
A smart passport comprising a smart inlay that includes a core substrate operative to store and exchange information contactlessly with an external reader, at least one physical security component coupled to the core substrate and operative to render the smart inlay and thereby the passport tamper-proof, and a logical security component incorporated in the core substrate and operative to render the smart inlay and thereby the passport forgery-proof. The physical security component is preferably selected from the group at least one tear line and at least one patterned adhesive, both operative to cause irreversible damage to the information storage and communication capabilities of the passport in case of tampering.
1 . A smart inlay comprising:
a. a core substrate operative to store and exchange information contactlessly with an external reader, said core substrate further conditioned to bind to a passport surface;
b. at least one physical security component coupled to said core substrate and operative to render the smart inlay tamper-proof; and
c. a logical security component incorporated in said core substrate and operative to render the smart inlay forgery-proof.
2 . The smart inlay of claim 1 , wherein said core substrate includes a contactless chip module for providing said information exchange operativeness and an antenna connected to said chip module for providing said information exchange operability.
3 . The smart inlay of claim 1 , wherein said at least one physical security component is selected from the group consisting of at least one tear line and at least one patterned adhesive.
4 . The smart inlay of claim 3 , wherein said at least one patterned adhesive is a thermo-set adhesive.
5 . The smart inlay of claim 3 , wherein said at least one patterned adhesive includes two patterned adhesives forming a composite adhesive structure.
6 . The smart inlay of claim 3 , wherein said at least one tear line is selected from the group of a local core substrate thinning and a core substrate perforation.
7 . The smart inlay of claim 1 , wherein said logical security feature includes a unique key obtained from a combination of a first logical link, a second logical link and personal information.
8 . The smart inlay of claim 1 , wherein said core substrate is made of a material selected from the group consisting of Teslin and Artisyn.
9 . A smart passport comprising:
a. a passport booklet; and
b. a smart inlay incorporated in said passport booklet, said smart inlay further including:
i. a core substrate operative to store and exchange information contactlessly with an external reader, said core substrate further conditioned to bind to a passport surface,
ii. at least one physical security component coupled to said core substrate and operative to render the smart inlay tamper-proof, and
iii. a logical security component incorporated in said core substrate and operative to render the smart inlay forgery-proof,
whereby said smart inlay provides tamper-proof and forgery-proof properties to the passport;
10 . The smart passport of claim 9 , wherein said smart inlay is attached to a passport cover.
11 . The smart passport of claim 9 , wherein said smart inlay is attached to an internal page of the passport.
12 . The smart passport of claim 9 , wherein said at least one physical security component is selected from the group consisting of at least one tear line and at least one patterned adhesive.
13 . The smart passport of claim 12 , wherein said at least one patterned adhesive is a thermo-set adhesive.
14 . The smart passport of claim 12 , wherein said at least one patterned adhesive includes two patterned adhesives forming a composite adhesive structure.
15 . The smart passport of claim 12 , wherein said at least one tear line is selected from the group of a local core substrate thinning and a core substrate perforation.
16 . The smart passport of claim 9 , wherein said logical security feature includes a unique key obtained from a combination of a first logical link, a second logical link and personal information.
17 . The smart passport of claim 9 , wherein said core substrate is made of a material selected from the group consisting of Teslin and Artisyn.
18 . A method for tamper-proofing and forgery-proofing a passport comprising the steps of:
a. providing a smart inlay operative to uniquely identify an authorized bearer of the passport, said smart inlay adaptively fitting into the passport; and
b. attaching said smart inlay to said passport.
19 . The method of claim 18 , wherein said step of providing a smart inlay further includes providing an inlay that includes:
i. a core substrate operative to store and exchange information contactlessly with an external reader, said core substrate further conditioned to bind to a passport surface,
ii. at least one physical security component coupled to said core substrate and operative to render said smart inlay tamper-proof, and
iii. a logical security component incorporated in said core substrate and operative to render said smart inlay forgery-proof.
20 . The method of claim 19 , wherein said step of attaching said smart inlay to said passport includes attaching said inlay to a cover of said passport.
21 . The method of claim 19 , wherein said providing of an inlay that includes at least one physical security component includes providing at least one physical security component selected from the group consisting of at least one tear line and at least one patterned adhesive.
22 . A method for preventing tampering in a smart passport that includes a contactless chip physically connected to an antenna, comprising the steps of:
a. providing at least one physical security component operative to disconnect the chip from the antenna; and
b. using said at least one physical component to protect the smart passport form tamper attempts.
23 . The method of claim 22 , wherein said step of providing at least one physical security component includes providing a smart inlay having a core substrate holding both the chip and the antenna, said core substrate further including at least one component selected from the group consisting of at least one tear line positioned in proximity to both the chip and the antenna and at least one patterned adhesive that glues the contactless chip to the antenna.
24 . The method of claim 22 , wherein said providing of a smart inlay with at least one patterned adhesive includes providing at least one thermo-set adhesive positioned to hold both the chip and the antenna.
25 . The method of claim 22 , wherein said providing of a smart inlay with at least one patterned adhesive includes providing two patterned adhesives forming a composite adhesive structure positioned to hold both the chip and the antenna.
26 . The method of claim 22 , wherein said providing of a smart inlay with at least one tear line includes providing a tear line selected from the group consisting of a local smart inlay core substrate thinning and a smart inlay core substrate perforation.