IP Library Granted Patent US 6,982,783
Granted Patent B2
US 6,982,783 · App. 10/864,591 · Granted Jan 3, 2006

Chucking system for modulating shapes of substrates

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Quick Facts
Patent No.
US 6,982,783
App. No.
10/864,591
Granted
Jan 3, 2006
Kind
B2
Abstract

The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.

Claims (23)

1. A chucking system to hold a substrate, said chucking system comprising:

a chuck body having a side with a pair of spaced-apart support regions extending therefrom terminating in a plane, said pair of spaced-apart support regions having a recess defined therebetween, with a portion of said chuck body in superimposition with said recess being transparent to radiation having a predetermined wavelength, with said chuck body being defined between said side and said plane.

2. The chucking system as recited in claim 1 wherein said radiation includes radiation having ultra-violet wavelengths.

3. The chucking system as recited in claim 1 wherein said chuck body further includes an additional support region spaced-apart from one of said pair of spaced-apart support regions, with an additional recess disposed therebetween.

4. The chucking system as recited in claim 3 wherein said additional recess includes a plurality of spaced-apart pins extending therefrom.

5. The chucking system as recited in claim 1 wherein said pair of spaced-apart support regions has a support surface associated therewith, facing away from said side, with said support surface being formed from a material adapted to conform to a profile of said substrate.

6. The chucking system as recited in claim 3 wherein each of said plurality of support regions has a support surface associated therewith, facing away from said side, with said support surface being formed from a material compliant in a first direction extending between said side and said plane to conform to a profile of said substrate while being resistant to movement in a direction transverse to said first direction.

7. The chucking system as recited in claim 3 further including a wall disposed within said additional recess, extending between one of said spaced-apart support regions and said additional support region to segment said additional recess into a plurality of sub-chambers.

8. The chucking system as recited in claim 3 wherein said support regions have a shape that is selected from a set of shapes consisting of annular, polygonal and circular.

9. The chucking system as recited in claim 3 wherein said chuck body further includes an exterior surface and a throughway extending through said chuck body placing said recesses in fluid communication with said exterior surface.

10. The chucking system as recited in claim 9 further including a pressure control system in fluid communication with said throughway, with said substrate resting against said support region, covering said recess, defining a chamber, with said pressure control system operating to control a pressure in said chamber.

11. A chucking system to hold a substrate, said chucking system comprising:

a chuck body having a side with a pair of spaced-apart support regions extending therefrom terminating in a plane, said pair of spaced-apart support regions having a recess defined therebetween, with a portion of said chuck body in superimposition with said recess being transparent to ultra-violet radiation, with said pair of spaced-apart support regions having a support surface associated therewith, facing away from said side, with said support surface being formed from a material compliant in a first direction extending between said side and said plane to conform to a profile of said substrate while being resistant to movement in a direction transverse to said first direction, with said chuck body being defined between said side and said plane.

12. The chucking system as recited in claim 11 wherein said chuck body further includes an additional support region spaced-apart from one of said pair of spaced-apart support regions, with an additional recess disposed therebetween.

13. The chucking system as recited in claim 12 wherein said additional recess includes a plurality of spaced-apart pins extending therefrom.

14. The chucking system as recited in claim 13 further including a wall disposed within said additional recess, extending between one of said support regions and said additional support region to segment said additional recess into a plurality of sub-chambers.

15. The chucking system as recited in claim 14 wherein said support regions have a shape that is selected from a set of shapes consisting of annular, polygonal and circular.

16. The chucking system as recited in claim 12 wherein said chuck body further includes an exterior surface and a throughway extending through said chuck body placing said recesses in fluid communication with said exterior surface and a pressure control system in fluid communication with said throughway, with said substrate resting against said support region, covering said recess, defining a chamber, with said pressure control system operating to control a pressure in said chamber.

17. A chucking system to hold a substrate, said chucking system comprising:

a chuck body having first and second opposed sides, with said body including sub-portions extending from said second side terminating in a plane and defining a recess therebetween, with remaining portions of said body being disposed between said plane and said first side, with a portion of said body in superimposition with said recess being transparent to radiation having a predetermined wavelength.

18. The chucking system as recited in claim 17 wherein said first side further includes an additional sub-portion spaced-apart from one of said sub-portions, with an additional recess disposed therebetween.

19. The chucking system as recited in claim 18 wherein said additional recess includes a plurality of spaced-apart pins extending therefrom.

20. The chucking system as recited in claim 19 further including a wall disposed within said additional recess, extending between one of said sub-portions and said additional sub-portion to segment said additional recess into a plurality of sub-chambers.

Assignments (2)
ASSIGNMENT OF SECURITY INTEREST IN PATENTS Recorded Nov 7, 2019
From: JPMORGAN CHASE BANK, N.A.
To: CITIBANK, N.A.
Reel/Frame 050967/0138 →
PATENT SECURITY AGREEMENT Recorded Aug 22, 2019
From: MAGIC LEAP, INC.; MOLECULAR IMPRINTS, INC.; MENTOR ACQUISITION ONE, LLC
To: JP MORGAN CHASE BANK, N.A.
Reel/Frame 050138/0287 →