Organic EL device and method for manufacturing the same
View Patent ↗An organic EL device includes a thin film transistor (TFT) array substrate including a first insulating substrate, a TFT formed on the first insulating substrate and a capacitor. It also includes an organic EL substrate including a second insulating substrate, and a transparent electrode, an organic EL layer and a metal electrode, which are sequentially stacked on the second insulating substrate. The TFT is coupled to the metal electrode.
1. An organic EL device, comprising:
a thin film transistor (TFT) array substrate including:
a first insulating substrate;
a TFT formed on the first insulating substrate;
a planarization layer formed on the TFT;
a conductive interface pad coupled to the TFT and deposited on the planarization layer;
a capacitor formed on the first insulating substrate; and
an organic EL substrate including:
a second insulating substrate,
a transparent electrode,
an organic EL layer, and
a metal electrode electrically coupled to the conductive interface pad on the thin film transistor array substrate by a conductive bonding agent, wherein the thin film transistor (TFT) array substrate further includes a conductive bump pad formed on the conductive interface pad.
2. The organic EL device of claim 1 , wherein the conductive bonding agent is further formed between the organic EL substrate and the thin film transistor array substrate.
3. The organic EL device of claim 1 , wherein the organic EL substrate further includes a protection film that prevents external oxygen and moisture from permeating.
4. The organic EL device according to claim 3 , wherein the protection film is formed of at least one of a SiNx layer and a SiO2.
5. The organic EL device of claim 4 , wherein the TFT array substrate and the organic EL substrate are sealed by a UV-curable agent.
6. The organic EL device according to claim 4 , wherein the TFT array substrate and the organic EL substrate are sealed by a UV-curable agent.
7. The organic EL device of claim 1 , wherein the conductive bonding agent is an anisotropic conductive film (ACF).
8. The organic EL device of claim 7 , wherein the anisotropic conductive film prevents external oxygen and moisture.
9. The organic EL device of claim 1 , wherein the conductive bump pad is coupled to the metal electrode.
10. The organic EL device of claim 9 , wherein the organic EL substrate is coupled to the thin film transistor array substrate through the conductive bonding agent.
11. The organic EL device of claim 10 , wherein the conductive bonding agent is an anisotropic conductive film (ACF).
12. The organic EL device of claim 11 , wherein the anisotropic conductive film prevents external oxygen and moisture.
13. The organic EL device of claim 1 , wherein the organic EL substrate further includes:
an insulating layer deposited around the transparent electrode.
14. The organic EL device of claim 13 , wherein the insulating layer is consisted of one from the group consisting of phenol resin, polyacryl resin and polyimide resin.
15. The organic EL device of claim 1 , wherein the organic EL substrate further includes:
an insulating layer deposited around the transparent electrode.
16. The organic EL device of claim 15 , wherein the insulating layer is consisted of one from the group consisting of phenol resin, polyacryl resin and polyimide resin.
17. The organic EL device of claim 16 , wherein the conductive bump pad is coupled to the metal electrode.
18. The organic EL device of claim 17 , wherein the organic EL substrate is coupled to the thin film transistor array substrate through the conductive bonding agent.