Surface acoustic wave device, package for the device, and method of fabricating the device
View Patent ↗A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, and a package housing the surface acoustic wave chip, a first surface of the package including an opening of the cavity being wider than a second surface of the package opposite to the first surface.
1. A surface acoustic wave device comprising:
a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed; and
a package housing the surface acoustic wave chip;
a first surface of the package including an opening of a cavity formed in the package being wider than a second surface of the package opposite to the first surface; and
castellations formed on sidewalls of the package, wherein the castellations start from the first surface of the package and do not reach the bottom surface thereof.