Electronic component protected against electrostatic discharges
View Patent ↗The electronic component, comprises an integrated circuit incorporating several separate functional blocks within a semiconductor substrate, and electrostatic discharge protection means. These electrostatic discharge protection means comprise several separate metal discharge rails (GNDi) placed above the substrate (SB) and respectively associated with the plurality of functional blocks (CRi), all these metal discharge rails being mutually unconnected electrically within the integrated circuit (CI) but connected electrically via an electrical connection (FLi) external to the integrated circuit to one and the same ground plane (SLG) forming a ground reference for the electrostatic discharges, this ground plane (SLG) being located outside the integrated circuit (CI), and possibly being a heat slug.
1. An electronic component, comprising:
an integrated circuit incorporating several separate functional blocks within a semiconductor substrate; and
electrostatic discharge protection means, comprising:
several separate metal discharge rails placed above the substrate and respectively associated with the plurality of functional blocks, all the metal discharge rails being mutually unconnected electrically within the integrated circuit but connected electrically via an electrical connection external to the integrated circuit to one and the same ground plane forming a ground reference for electrostatic discharges, the ground plane being located outside the integrated circuit.
2. The electronic component according to claim 1 , including separate bonding wires between the integrated circuit and the ground plane, which wires provide the said external connection between the discharge rails and the ground plane.
3. The electronic component according to claim 1 , including a package containing the integrated circuit, and in that the said ground plane comprises a metal plate having one face located outside the package.
4. The electronic component according to claim 3 , including separate bonding wires between the integrated circuit and the ground plane, which wires provide the said external connection between the discharge rails and the ground plane.
5. The electronic component according to claim 3 , wherein the said metal plate forming the said ground plane is a heat slug placed beneath the integrated circuit.
6. The electronic component according to claim 5 , including separate bonding wires between the integrated circuit and the ground plane, which wires provide the said external connection between the discharge rails and the ground plane.
7. The electronic component according to claim 1 , further comprising:
a thin metal plate fixed to the integrated circuit, the thin metal plate acting as a ground reference for radiofrequency signals.
8. The electronic component according to claim 7 , wherein the ground plane forming a ground reference for electrostatic discharges comprises the thin metal plate.
9. The electronic component according to claim 7 , wherein at least one of the several separate functional blocks within the semiconductor substrate comprises a low noise amplifier that is electrically coupled with the thin metal plate acting as a ground reference for radiofrequency signals associated with the low noise amplifier.
10. An electronic device comprising a plurality of electronic components, at least one of the plurality of electronic components comprising:
an integrated circuit incorporating several separate functional blocks within a semiconductor substrate; and
electrostatic discharge protection means, comprising:
several separate metal discharge rails placed above the substrate and respectively associated with the plurality of functional blocks, all the metal discharge rails being mutually unconnected electrically within the integrated circuit but connected electrically via an electrical connection external to the integrated circuit to one and the same ground plane forming a ground reference for electrostatic discharges, the ground plane being located outside the integrated circuit.
11. The electronic device according to claim 10 , including separate bonding wires between the integrated circuit and the ground plane, which wires provide the said external connection between the discharge rails and the ground plane.
12. The electronic device according to claim 10 , including a package containing the integrated circuit, and in that the said ground plane comprises a metal plate having one face located outside the package.
13. The electronic device according to claim 12 , including separate bonding wires between the integrated circuit and the ground plane, which wires provide the said external connection between the discharge rails and the ground plane.
14. The electronic device according to claim 12 , wherein the said metal plate forming the said ground plane is a heat slug placed beneath the integrated circuit.
15. The electronic device according to claim 14 , including separate bonding wires between the integrated circuit and the ground plane, which wires provide the said external connection between the discharge rails and the ground plane.
16. The electronic device according to claim 10 , further comprising:
a thin metal plate fixed to the integrated circuit, the thin metal plate acting as a ground reference for radiofrequency signals.
17. The electronic device according to claim 16 , wherein the ground plane forming a ground reference for electrostatic discharges comprises the thin metal plate.
18. The electronic device according to claim 16 , wherein at least one of the several separate functional blocks within the semiconductor substrate comprises a low noise amplifier that is electrically coupled with the thin metal plate acting as a ground reference for radiofrequency signals associated with the low noise amplifier.